Tzong-Che Ho

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Smart clothing and its device mount
- Patent number 12,022,629
- Issue date Jun 25, 2024
- AMPAK TECHNOLOGY INC.
- Wen-Sung Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resonance body and power dividing and combining device
- Patent number 11,962,060
- Issue date Apr 16, 2024
- AMPAK TECHNOLOGY INC.
- Fure-Tzahn Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS microphone package
- Patent number 9,369,788
- Issue date Jun 14, 2016
- Industrial Technology Research Institute
- Tzong-Che Ho
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Organic packaging carrier
- Patent number 9,343,651
- Issue date May 17, 2016
- Industrial Technology Research Institute
- Lung-Tai Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
MEMS acoustic transducer and method for fabricating the same
- Patent number 9,236,275
- Issue date Jan 12, 2016
- Industrial Technology Research Institute
- Chien-Nan Yeh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure and fabrication method of a sensing device
- Patent number 9,133,018
- Issue date Sep 15, 2015
- Industrial Technology Research Institute
- Lung-Tai Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensing device and manufacturing method thereof
- Patent number 8,763,457
- Issue date Jul 1, 2014
- Industrial Technology Research Institute
- Lung-Tai Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive transducer and fabrication method
- Patent number 8,693,711
- Issue date Apr 8, 2014
- Industrial Technology Research Institute
- Tzong-Che Ho
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Ultra thin package for electric acoustic sensor chip of micro elect...
- Patent number 8,508,022
- Issue date Aug 13, 2013
- Industrial Technology Research Institute
- Tzong-Che Ho
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vacuum hermetic organic packaging carrier
- Patent number 8,421,216
- Issue date Apr 16, 2013
- Industrial Technology Research Institute
- Lung-Tai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED lamp
- Patent number RE43626
- Issue date Sep 4, 2012
- Transpacific IP I Ltd.
- Ra-Min Tain
- 362 - Illumination
Information Patent Grant
Vacuum hermetic organic packaging carrier and sensor device package
- Patent number 7,973,454
- Issue date Jul 5, 2011
- Industrial Technology Research Institute
- Lung-Tai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned wafer or chip structure, and self-aligned stacked stru...
- Patent number 7,969,016
- Issue date Jun 28, 2011
- Industrial Technology Research Institute
- Jung-Tai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level sensing package and manufacturing process thereof
- Patent number 7,915,065
- Issue date Mar 29, 2011
- Industrial Technology Research Institute
- Lung-Tai Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
LED lamp
- Patent number 7,413,326
- Issue date Aug 19, 2008
- Industrial Technology Research Institute
- Ra-Min Tain
- F21 - LIGHTING
Information Patent Grant
Side structure of a bare LED and backlight module thereof
- Patent number 7,375,384
- Issue date May 20, 2008
- Industrial Technology Research Institute
- Ra-Min Tain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED lamp
- Patent number 7,314,291
- Issue date Jan 1, 2008
- Industrial Technology Research Institute
- Ra-Min Tain
- F21 - LIGHTING
Information Patent Grant
Side structure of a bare LED and backlight module thereof
- Patent number 7,312,478
- Issue date Dec 25, 2007
- Industrial Technology Research Institute
- Ra-Min Tain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3-D stackable semiconductor package
- Patent number 7,119,429
- Issue date Oct 10, 2006
- Industrial Technology Research Institute
- Shu-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SMART CLOTHING AND ITS DEVICE MOUNT
- Publication number 20230284403
- Publication date Sep 7, 2023
- AMPAK Technology Inc.
- Wen-Sung FAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESONANCE BODY AND POWER DIVIDING AND COMBINING DEVICE
- Publication number 20210399399
- Publication date Dec 23, 2021
- AMPAK TECHNOLOGY INC.
- FURE-TZAHN TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS MICROPHONE PACKAGE
- Publication number 20160165358
- Publication date Jun 9, 2016
- Industrial Technology Research Institute
- Tzong-Che HO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ACOUSTIC TRANSDUCER AND METHOD FOR FABRICATING THE SAME
- Publication number 20130140655
- Publication date Jun 6, 2013
- Industrial Technology Research Institute
- Chien-Nan YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20120260747
- Publication date Oct 18, 2012
- Industrial Technology Research Institute
- Lung-Tai Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ORGANIC PACKAGING CARRIER
- Publication number 20120241938
- Publication date Sep 27, 2012
- Industrial Technology Research Institute
- Lung-Tai Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MICROPHONE PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20120146163
- Publication date Jun 14, 2012
- Industrial Technology Research Institute
- Tzong-Che Ho
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VACUUM HERMETIC ORGANIC PACKAGING CARRIER
- Publication number 20110297434
- Publication date Dec 8, 2011
- Industrial Technology Research Institute
- Lung-Tai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE TRANSDUCER AND FABRICATION METHOD
- Publication number 20110150261
- Publication date Jun 23, 2011
- Industrial Technology Research Institute
- Tzong-Che HO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
STRUCTURE AND FABRICATION METHOD OF A SENSING DEVICE
- Publication number 20110018075
- Publication date Jan 27, 2011
- Lung-Tai Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ULTRA THIN PACKAGE FOR ELECTRIC ACOUSTIC SENSOR CHIP OF MICRO ELECT...
- Publication number 20090161901
- Publication date Jun 25, 2009
- Industrial Technology Research Institute
- Tzong-Che Ho
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL SENSING PACKAGE AND MANUFACTURING PROCESS THEREOF
- Publication number 20090124074
- Publication date May 14, 2009
- Industrial Technology Research Institute
- Lung-Tai Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer level sensing package and manufacturing process thereof
- Publication number 20090121299
- Publication date May 14, 2009
- Industrial Technology Research Institute
- Lung-Tai Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SELF-ALIGNED WAFER OR CHIP STRUCTURE, SELF-ALIGNED STACKED STRUCTUR...
- Publication number 20080315433
- Publication date Dec 25, 2008
- Industrial Technology Research Institute
- Jung-Tai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image stabilization driving device
- Publication number 20080284860
- Publication date Nov 20, 2008
- Industrial Technology Research Institute
- Wen-I Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
URINE DETECTION SYSTEM AND METHOD
- Publication number 20080278337
- Publication date Nov 13, 2008
- Industrial Technology Research Institute
- Tsun-Che Huang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Diaper
- Publication number 20080074274
- Publication date Mar 27, 2008
- Industrial Technology Research Institute
- Ying-Chiang Hu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
LED LAMP
- Publication number 20070297178
- Publication date Dec 27, 2007
- Industrial Technology Research Institute
- Ra-Min Tain
- F21 - LIGHTING
Information Patent Application
Side structure of a bare LED and backlight module thereof
- Publication number 20070205427
- Publication date Sep 6, 2007
- Industrial Technology Research Institute
- Ra-Min Tain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3-D stackable semiconductor package
- Publication number 20060027908
- Publication date Feb 9, 2006
- Shu-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Side structure of a bare LED and backlight module thereof
- Publication number 20060027827
- Publication date Feb 9, 2006
- Industrial Technology Research Institute
- Ra-Min Tain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED lamp
- Publication number 20060001384
- Publication date Jan 5, 2006
- Industrial Technology Research Institute
- Ra-Min Tain
- F21 - LIGHTING

Tzong-Che Ho

Person

Patents Grantslast 30 patents

Smart clothing and its device mount

Resonance body and power dividing and combining device

MEMS microphone package

Organic packaging carrier

MEMS acoustic transducer and method for fabricating the same

Structure and fabrication method of a sensing device

Sensing device and manufacturing method thereof

Capacitive transducer and fabrication method

Ultra thin package for electric acoustic sensor chip of micro elect...

Vacuum hermetic organic packaging carrier

LED lamp

Vacuum hermetic organic packaging carrier and sensor device package

Self-aligned wafer or chip structure, and self-aligned stacked stru...

Wafer level sensing package and manufacturing process thereof

LED lamp

Side structure of a bare LED and backlight module thereof

LED lamp

Side structure of a bare LED and backlight module thereof

3-D stackable semiconductor package

Patents Applicationslast 30 patents

SMART CLOTHING AND ITS DEVICE MOUNT

RESONANCE BODY AND POWER DIVIDING AND COMBINING DEVICE

MEMS MICROPHONE PACKAGE

MEMS ACOUSTIC TRANSDUCER AND METHOD FOR FABRICATING THE SAME

SENSING DEVICE AND MANUFACTURING METHOD THEREOF

ORGANIC PACKAGING CARRIER

MICROPHONE PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

VACUUM HERMETIC ORGANIC PACKAGING CARRIER

CAPACITIVE TRANSDUCER AND FABRICATION METHOD

STRUCTURE AND FABRICATION METHOD OF A SENSING DEVICE

ULTRA THIN PACKAGE FOR ELECTRIC ACOUSTIC SENSOR CHIP OF MICRO ELECT...

WAFER LEVEL SENSING PACKAGE AND MANUFACTURING PROCESS THEREOF

Wafer level sensing package and manufacturing process thereof

SELF-ALIGNED WAFER OR CHIP STRUCTURE, SELF-ALIGNED STACKED STRUCTUR...

Image stabilization driving device

URINE DETECTION SYSTEM AND METHOD

Diaper

LED LAMP

Side structure of a bare LED and backlight module thereof

3-D stackable semiconductor package

Side structure of a bare LED and backlight module thereof

LED lamp