Tzong-Da Ho

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making semiconductor package with heat spreader
- Patent number RE39957
- Issue date Dec 25, 2007
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- 438 - Semiconductor device manufacturing: process
Information Patent Grant
Ball grid array substrate strip with warpage-preventive linkage str...
- Patent number 7,148,561
- Issue date Dec 12, 2006
- Siliconware Precision Industries Co., Ltd.
- Chien Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package with heat sink
- Patent number 7,074,645
- Issue date Jul 11, 2006
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flash-preventing semiconductor package
- Patent number 6,867,487
- Issue date Mar 15, 2005
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with heat sink
- Patent number 6,844,622
- Issue date Jan 18, 2005
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with crack-preventing member
- Patent number 6,707,167
- Issue date Mar 16, 2004
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat non-leaded semiconductor package and method of fabricatin...
- Patent number 6,703,691
- Issue date Mar 9, 2004
- Siliconware Precision Industries Co., Ltd.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate of semiconductor package
- Patent number 6,699,731
- Issue date Mar 2, 2004
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semicondctor package
- Patent number 6,657,296
- Issue date Dec 2, 2003
- Siliconware Precision Industries Co., Ltd.
- Tzong-Da Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with stacked chips
- Patent number 6,650,006
- Issue date Nov 18, 2003
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked multi-chip package structure with on-chip integration of pa...
- Patent number 6,611,434
- Issue date Aug 26, 2003
- Siliconware Precision Industries Co., Ltd.
- Randy H. Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with stacked chips
- Patent number 6,541,870
- Issue date Apr 1, 2003
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with embedded heat-dissipating device
- Patent number 6,507,104
- Issue date Jan 14, 2003
- Siliconware Precision Industries Co., Ltd.
- Tzong Da Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate of semiconductor package
- Patent number 6,483,039
- Issue date Nov 19, 2002
- Siliconware Precision Industries, Co., Ltd.
- Chien-Ping Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layout method for thin and fine ball grid array package substrate w...
- Patent number 6,479,894
- Issue date Nov 12, 2002
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cavity-down tape ball grid array package assembly with grounded hea...
- Patent number 6,469,897
- Issue date Oct 22, 2002
- Siliconware Precision Industries Co., Ltd.
- Tzong-Da Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating method for semiconductor package
- Patent number 6,458,626
- Issue date Oct 1, 2002
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a flip-chip ball-grid-array package with mold...
- Patent number 6,451,625
- Issue date Sep 17, 2002
- Siliconware Precision Industries, Co., Ltd.
- Han-Ping Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package with interdigitated power ring and ground ring
- Patent number 6,449,169
- Issue date Sep 10, 2002
- Siliconware Precision Industries Co., Ltd.
- Tzong-Da Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of achieving solder ball coplanarity on ball grid array inte...
- Patent number 6,443,351
- Issue date Sep 3, 2002
- Siliconware Precision Industries Co., Ltd.
- Chien Ping Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making semiconductor package with heat spreader
- Patent number 6,444,498
- Issue date Sep 3, 2002
- Siliconware Precision Industries Co., Ltd.
- Chien Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package based on window pad type of leadframe and met...
- Patent number 6,440,779
- Issue date Aug 27, 2002
- Siliconware Precision Industries Co., Ltd.
- Fly Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of breaking electrically conductive traces on substrate into...
- Patent number 6,380,059
- Issue date Apr 30, 2002
- Tzong-Da Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Externally-embedded heat-dissipating device for ball grid array int...
- Patent number 6,369,455
- Issue date Apr 9, 2002
- Siliconware Precision Industries Co., Ltd.
- Tzong-Da Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array integrated circuit package structure
- Patent number 6,359,341
- Issue date Mar 19, 2002
- Siliconware Precision Industries, Co., Ltd.
- Chien Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layout method for thin and fine ball grid array package substrate w...
- Patent number 6,319,750
- Issue date Nov 20, 2001
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a ball grid array integrated circuit package...
- Patent number 6,306,682
- Issue date Oct 23, 2001
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball-grid array integrated circuit package with an embedded type of...
- Patent number 6,282,094
- Issue date Aug 28, 2001
- Siliconware Precision Industries, Co., Ltd.
- Randy H. Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Fabrication method of semiconductor package with heat sink
- Publication number 20050095875
- Publication date May 5, 2005
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally enhanced wafer-level chip scale package and method of fab...
- Publication number 20040106291
- Publication date Jun 3, 2004
- Siliconware Precision Industries Co., Ltd.
- Tzong Da Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with crack-preventing member
- Publication number 20030094676
- Publication date May 22, 2003
- Siliconware Precision Industries Co., Ltd.
- Chien -Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20030057534
- Publication date Mar 27, 2003
- Siliconware Precision Industries Co., Ltd.
- Tzong-Da Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Quad flat non-leaded semiconductor package and method of fabricatin...
- Publication number 20030042583
- Publication date Mar 6, 2003
- Siliconware Precision Industries Co., Ltd.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method for fabricating the same
- Publication number 20020180024
- Publication date Dec 5, 2002
- Siliconware Precision Industries Co., Ltd., Taiwan R.O.C.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with heat sink
- Publication number 20020180035
- Publication date Dec 5, 2002
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with stacked chips
- Publication number 20020175401
- Publication date Nov 28, 2002
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally enhanced wafer-level chip scale package and method of fab...
- Publication number 20020173077
- Publication date Nov 21, 2002
- Tzong Da Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array substrate strip with warpage-preventive linkage str...
- Publication number 20020171129
- Publication date Nov 21, 2002
- Chien Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with embedded heat-dissipating device
- Publication number 20020163075
- Publication date Nov 7, 2002
- Siliconware Precision Industries, Co., Ltd.
- Tzong Da Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE OF SEMICONDUCTOR PACKAGE
- Publication number 20020137257
- Publication date Sep 26, 2002
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY PACKAGE WITH INTERDIGITATED POWER RING AND GROUND RING
- Publication number 20020118522
- Publication date Aug 29, 2002
- Siliconware Precision Industries Co., Ltd.
- Tzong-Da Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate of semiconductor package
- Publication number 20020112881
- Publication date Aug 22, 2002
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cavity-down tape ball grid array package assembly with grounded hea...
- Publication number 20020114133
- Publication date Aug 22, 2002
- Siliconware Precision Industries Co., Ltd.
- Tzong-Da Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A FLIP-CHIP BALL-GRID-ARRAY PACKAGE WITH MOLD...
- Publication number 20020095192
- Publication date Jul 18, 2002
- Siliconware Precision Industries Co., Ltd.
- Han-Ping Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with heat dissipating element
- Publication number 20020079570
- Publication date Jun 27, 2002
- Siliconware Precision Industries Co., Ltd,
- Tzong-Da Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layout method for thin and fine ball grid array package substrate w...
- Publication number 20020058354
- Publication date May 16, 2002
- Siliconware Precision Industries
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS

Tzong-Da Ho

Person

Patents Grantslast 30 patents

Method of making semiconductor package with heat spreader

Ball grid array substrate strip with warpage-preventive linkage str...

Fabrication method of semiconductor package with heat sink

Flash-preventing semiconductor package

Semiconductor package with heat sink

Semiconductor package with crack-preventing member

Quad flat non-leaded semiconductor package and method of fabricatin...

Substrate of semiconductor package

Semicondctor package

Semiconductor package with stacked chips

Stacked multi-chip package structure with on-chip integration of pa...

Semiconductor package with stacked chips

Semiconductor package with embedded heat-dissipating device

Substrate of semiconductor package

Layout method for thin and fine ball grid array package substrate w...

Cavity-down tape ball grid array package assembly with grounded hea...

Fabricating method for semiconductor package

Method of fabricating a flip-chip ball-grid-array package with mold...

Ball grid array package with interdigitated power ring and ground ring

Method of achieving solder ball coplanarity on ball grid array inte...

Method of making semiconductor package with heat spreader

Semiconductor package based on window pad type of leadframe and met...

Method of breaking electrically conductive traces on substrate into...

Externally-embedded heat-dissipating device for ball grid array int...

Ball grid array integrated circuit package structure

Layout method for thin and fine ball grid array package substrate w...

Method of fabricating a ball grid array integrated circuit package...

Ball-grid array integrated circuit package with an embedded type of...

Patents Applicationslast 30 patents

Fabrication method of semiconductor package with heat sink

Thermally enhanced wafer-level chip scale package and method of fab...

Semiconductor package with crack-preventing member

Semiconductor package

Quad flat non-leaded semiconductor package and method of fabricatin...

Semiconductor package and method for fabricating the same

Semiconductor package with heat sink

Semiconductor package with stacked chips

Thermally enhanced wafer-level chip scale package and method of fab...

Ball grid array substrate strip with warpage-preventive linkage str...

Semiconductor package with embedded heat-dissipating device

SUBSTRATE OF SEMICONDUCTOR PACKAGE

BALL GRID ARRAY PACKAGE WITH INTERDIGITATED POWER RING AND GROUND RING

Substrate of semiconductor package

Cavity-down tape ball grid array package assembly with grounded hea...

METHOD OF FABRICATING A FLIP-CHIP BALL-GRID-ARRAY PACKAGE WITH MOLD...

Semiconductor package with heat dissipating element

Layout method for thin and fine ball grid array package substrate w...