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TZU-CHUN TANG

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  • KAOHSIUNG CITY, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD OF MANUFACTURING ELECTRONIC APPARATUS
    • Publication number 20240387367
    • Publication date Nov 21, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tzu-Chun Tang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD AND STRUCTURE FOR 3DIC POWER DISTRIBUTION
    • Publication number 20240387502
    • Publication date Nov 21, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chung-Hao Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MANUFACTURING METHOD OF PACKAGE STRUCTURE
    • Publication number 20240371842
    • Publication date Nov 7, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chuei-Tang Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20240321786
    • Publication date Sep 26, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chung-Hao Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20240258287
    • Publication date Aug 1, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chuei-Tang Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED FAN-OUT PACKAGE
    • Publication number 20240213186
    • Publication date Jun 27, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chuei-Tang Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20230178530
    • Publication date Jun 8, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chuei-Tang Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD AND STRUCTURE FOR 3DIC POWER DISTRIBUTION
    • Publication number 20230154913
    • Publication date May 18, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chung-Hao Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20230065844
    • Publication date Mar 2, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tzu-Chun Tang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20230061876
    • Publication date Mar 2, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chung-Hao Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
    • Publication number 20230062136
    • Publication date Mar 2, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chuei-Tang Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20220285331
    • Publication date Sep 8, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chuei-Tang Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED FAN-OUT PACKAGE
    • Publication number 20220270990
    • Publication date Aug 25, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chuei-Tang Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC APPARATUS
    • Publication number 20220059450
    • Publication date Feb 24, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tzu-Chun Tang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
    • Publication number 20210183794
    • Publication date Jun 17, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Tzu-Chun Tang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
    • Publication number 20200335477
    • Publication date Oct 22, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Albert Wan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED FAN-OUT PACKAGE
    • Publication number 20200294943
    • Publication date Sep 17, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chuei-Tang Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Packaged Semiconductor Devices and Packaging Methods
    • Publication number 20200118971
    • Publication date Apr 16, 2020
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tzu-Chun Tang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20200111753
    • Publication date Apr 9, 2020
    • Taiwan Semiconductor Manufacturing company Ltd.
    • CHUEI-TANG WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
    • Publication number 20200106156
    • Publication date Apr 2, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chun-Lin Lu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED FAN-OUT PACKAGE
    • Publication number 20200105687
    • Publication date Apr 2, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chuei-Tang Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Stacked Coil for Wireless Charging Structure on InFO Package
    • Publication number 20200090855
    • Publication date Mar 19, 2020
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    METHOD OF MANUFACTURING INTEGRATED FAN-OUT PACKAGE
    • Publication number 20190355694
    • Publication date Nov 21, 2019
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Albert Wan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Stacked Coil for Wireless Charging Structure on InFO Package
    • Publication number 20190279810
    • Publication date Sep 12, 2019
    • Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC APPARATUS
    • Publication number 20190122978
    • Publication date Apr 25, 2019
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Tzu-Chun Tang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20190096829
    • Publication date Mar 28, 2019
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Tzu-Chun Tang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Stacked Coil for Wireless Charging Structure on InFO Package
    • Publication number 20190096565
    • Publication date Mar 28, 2019
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
    • Publication number 20190035877
    • Publication date Jan 31, 2019
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Packaged Semiconductor Devices and Packaging Methods
    • Publication number 20180350771
    • Publication date Dec 6, 2018
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tzu-Chun Tang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20180350752
    • Publication date Dec 6, 2018
    • Taiwan Semiconductor Manufacturing company Ltd.
    • CHUEI-TANG WANG
    • H01 - BASIC ELECTRIC ELEMENTS