TZU-KAI LAN

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YILAN COUNTY, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having varying conductive pad sizes
- Patent number 11,699,673
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,152,295
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having varying conductive pad sizes
- Patent number 11,011,487
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,867,951
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having varying conductive pad sizes
- Patent number 10,700,030
- Issue date Jun 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,340,242
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING VARYING CONDUCTIVE PAD SIZES
- Publication number 20210272919
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING VARYING CONDUCTIVE PAD SIZES
- Publication number 20200321297
- Publication date Oct 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING VARYING CONDUCTIVE PAD SIZES
- Publication number 20200058611
- Publication date Feb 20, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190318987
- Publication date Oct 17, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-HAO LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190244925
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- KUAN-YU HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190067231
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- KUAN-YU HUANG
- H01 - BASIC ELECTRIC ELEMENTS

TZU-KAI LAN

Person

Patents Grantslast 30 patents

Semiconductor package having varying conductive pad sizes

Semiconductor package structure and method for manufacturing the same

Semiconductor package having varying conductive pad sizes

Semiconductor device

Semiconductor package having varying conductive pad sizes

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE HAVING VARYING CONDUCTIVE PAD SIZES

SEMICONDUCTOR PACKAGE HAVING VARYING CONDUCTIVE PAD SIZES

SEMICONDUCTOR PACKAGE HAVING VARYING CONDUCTIVE PAD SIZES

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME