Tzu-Ming Ou Yang

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor memory structure and method for forming the same
- Patent number 12,322,698
- Issue date Jun 3, 2025
- Winbond Electronics Corp.
- Hung-Jung Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of memory structure
- Patent number 12,262,528
- Issue date Mar 25, 2025
- Winbond Electronics Corp.
- Keng-Ping Lin
Information Patent Grant
Method for forming a semiconductor structure
- Patent number 12,206,010
- Issue date Jan 21, 2025
- Winbond Electronics Corp.
- Shu-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for memory structure
- Patent number 12,193,214
- Issue date Jan 7, 2025
- Winbond Electronics Corp.
- Shu-Ming Li
Information Patent Grant
Dynamic random access memory having word line buried in chop struct...
- Patent number 12,144,165
- Issue date Nov 12, 2024
- Winbond Electronics Corp.
- Chang-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 11,683,926
- Issue date Jun 20, 2023
- Winbond Electronics Corp.
- Po-Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,664,438
- Issue date May 30, 2023
- Winbond Electronics Corp.
- Shu-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,631,642
- Issue date Apr 18, 2023
- Winbond Electronics Corp.
- Shu-Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Landing pad structure
- Patent number 11,610,897
- Issue date Mar 21, 2023
- Winbond Electronics Corp.
- Keng-Ping Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device
- Patent number 11,557,595
- Issue date Jan 17, 2023
- Winbond Electronics Corp.
- Shu-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory structure and manufacturing method thereof
- Patent number 11,527,537
- Issue date Dec 13, 2022
- Winbond Electronics Corp.
- Keng-Ping Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices and methods for forming the same
- Patent number 11,527,475
- Issue date Dec 13, 2022
- Winbond Electronics Corp.
- Ling-Chun Tseng
- G11 - INFORMATION STORAGE
Information Patent Grant
Dynamic random access memory and method of manufacturing the same
- Patent number 11,417,666
- Issue date Aug 16, 2022
- Winbond Electronics Corp.
- Chang-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DRAM semiconductor device having reduced parasitic capacitance betw...
- Patent number 11,404,422
- Issue date Aug 2, 2022
- Winbond Electronics Corp.
- Wei-Che Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory structure and manufacturing method therefor
- Patent number 11,342,332
- Issue date May 24, 2022
- Winbond Electronics Corp.
- Shu-Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning method
- Patent number 11,289,493
- Issue date Mar 29, 2022
- Winbond Electronics Corp.
- Keng-Ping Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 11,217,527
- Issue date Jan 4, 2022
- Winbond Electronics Corp.
- Shu-Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Landing pad structure and method of manufacturing the same
- Patent number 11,011,525
- Issue date May 18, 2021
- Winbond Electronics Corp.
- Keng-Ping Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,985,262
- Issue date Apr 20, 2021
- Winbond Electronics Corp.
- Keng-Ping Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,847,380
- Issue date Nov 24, 2020
- Winbond Electronics Corp.
- Shu-Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DRAM semiconductor device having reduced parasitic capacitance betw...
- Patent number 10,797,057
- Issue date Oct 6, 2020
- Winbond Electronic Corp.
- Wei-Che Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and method for manufacturing the same
- Patent number 10,756,099
- Issue date Aug 25, 2020
- Winbond Electronics Corp.
- Shu-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,665,471
- Issue date May 26, 2020
- Winbond Electronics Corp.
- Shu-Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and method for manufacturing the same
- Patent number 10,593,676
- Issue date Mar 17, 2020
- Winbond Electronics Corp.
- Shu-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF
- Publication number 20250227922
- Publication date Jul 10, 2025
- WINBOND ELECTRONICS CORP.
- Keng-Ping Lin
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250167124
- Publication date May 22, 2025
- WINBOND ELECTRONICS CORP.
- Meng-Wei Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250048620
- Publication date Feb 6, 2025
- WINBOND ELECTRONICS CORP.
- Ying-Hung Chen
Information Patent Application
DRY ETCHING METHODS FOR REDUCING FLUOROCARBON-CONTAINING GAS EMISSIONS
- Publication number 20240212988
- Publication date Jun 27, 2024
- WINBOND ELECTRONICS CORP.
- Yuan-Hao SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240179889
- Publication date May 30, 2024
- WINBOND ELECTRONICS CORP.
- Chien-Ming Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE
- Publication number 20240170296
- Publication date May 23, 2024
- WINBOND ELECTRONICS CORP.
- Hung-Jung YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240164087
- Publication date May 16, 2024
- WINBOND ELECTRONICS CORP.
- Wei-Zhi FANG
Information Patent Application
MEMORY DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20230389300
- Publication date Nov 30, 2023
- WINBOND ELECTRONICS CORP.
- Yuan-Hao Su
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR MEMORY STRUCTURE
- Publication number 20230337417
- Publication date Oct 19, 2023
- WINBOND ELECTRONICS CORP.
- Ling-Chun TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE
- Publication number 20230268417
- Publication date Aug 24, 2023
- WINBOND ELECTRONICS CORP.
- Shu-Ming LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20230078443
- Publication date Mar 16, 2023
- WINBOND ELECTRONICS CORP.
- Po-Han WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF MEMORY STRUCTURE
- Publication number 20230049425
- Publication date Feb 16, 2023
- WINBOND ELECTRONICS CORP.
- Keng-Ping Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220415781
- Publication date Dec 29, 2022
- WINBOND ELECTRONICS CORP.
- Hung-Jung YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220352172
- Publication date Nov 3, 2022
- WINBOND ELECTRONICS CORP.
- Keng-Ping Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC RANDOM ACCESS MEMORY
- Publication number 20220344348
- Publication date Oct 27, 2022
- WINBOND ELECTRONICS CORP.
- Chang-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220223598
- Publication date Jul 14, 2022
- WINBOND ELECTRONICS CORP.
- Tzu-Ming OU YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR MEMORY STRUCTURE
- Publication number 20220223600
- Publication date Jul 14, 2022
- WINBOND ELECTRONICS CORP.
- Shu-Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220093511
- Publication date Mar 24, 2022
- WINBOND ELECTRONICS CORP.
- Shu-Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY STURCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20210398982
- Publication date Dec 23, 2021
- WINBOND ELECTRONICS CORP.
- Shu-Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20210225763
- Publication date Jul 22, 2021
- WINBOND ELECTRONICS CORP.
- Ling-Chun TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LANDING PAD STRUCTURE
- Publication number 20210225850
- Publication date Jul 22, 2021
- WINBOND ELECTRONICS CORP.
- Keng-Ping Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20210175169
- Publication date Jun 10, 2021
- WINBOND ELECTRONICS CORP.
- Shu-Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING METHOD
- Publication number 20210134810
- Publication date May 6, 2021
- WINBOND ELECTRONICS CORP.
- Keng-Ping Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20210134980
- Publication date May 6, 2021
- WINBOND ELECTRONICS CORP.
- Shu-Ming LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRAM SEMICONDUCTOR DEVICE HAVING REDUCED PARASITIC CAPACITANCE BETW...
- Publication number 20210013211
- Publication date Jan 14, 2021
- WINBOND ELECTRONICS CORP.
- Wei-Che CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC RANDOM ACCESS MEMORY AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210005614
- Publication date Jan 7, 2021
- WINBOND ELECTRONICS CORP.
- Chang-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20200343255
- Publication date Oct 29, 2020
- WINBOND ELECTRONICS CORP.
- Shu-Ming LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200219733
- Publication date Jul 9, 2020
- WINBOND ELECTRONICS CORP.
- Shu-Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LANDING PAD STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200219889
- Publication date Jul 9, 2020
- WINBOND ELECTRONICS CORP.
- Keng-Ping Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTIVE RANDOM ACCESS MEMORY STRUCTURE AND MANUFACTURING METHOD T...
- Publication number 20190334084
- Publication date Oct 31, 2019
- WINBOND ELECTRONICS CORP.
- Tzu-Ming OU YANG
- H01 - BASIC ELECTRIC ELEMENTS

Tzu-Ming Ou Yang

Person

Patents Grantslast 30 patents

Semiconductor memory structure and method for forming the same

Manufacturing method of memory structure

Method for forming a semiconductor structure

Manufacturing method for memory structure

Dynamic random access memory having word line buried in chop struct...

Method of manufacturing semiconductor structure

Semiconductor structure and method for forming the same

Method for manufacturing semiconductor device

Landing pad structure

Memory device

Memory structure and manufacturing method thereof

Memory devices and methods for forming the same

Dynamic random access memory and method of manufacturing the same

DRAM semiconductor device having reduced parasitic capacitance betw...

Memory structure and manufacturing method therefor

Patterning method

Semiconductor device and manufacturing method of the same

Landing pad structure and method of manufacturing the same

Semiconductor structure and manufacturing method thereof

Semiconductor device and manufacturing method thereof

DRAM semiconductor device having reduced parasitic capacitance betw...

Memory device and method for manufacturing the same

Semiconductor device and manufacturing method thereof

Memory device and method for manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

DRY ETCHING METHODS FOR REDUCING FLUOROCARBON-CONTAINING GAS EMISSIONS

MEMORY DEVICE AND METHOD OF FORMING THE SAME

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

MEMORY DEVICE AND METHOD OF FORMING THE SAME

METHOD FOR FORMING SEMICONDUCTOR MEMORY STRUCTURE

METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

MANUFACTURING METHOD OF MEMORY STRUCTURE

SEMICONDUCTOR MEMORY STRUCTURE AND METHOD FOR FORMING THE SAME

MEMORY STRUCTURE AND MANUFACTURING METHOD THEREOF

DYNAMIC RANDOM ACCESS MEMORY

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

MANUFACTURING METHOD FOR MEMORY STRUCTURE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

MEMORY STURCTURE AND MANUFACTURING METHOD THEREFOR

MEMORY DEVICES AND METHODS FOR FORMING THE SAME

LANDING PAD STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

PATTERNING METHOD

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

DRAM SEMICONDUCTOR DEVICE HAVING REDUCED PARASITIC CAPACITANCE BETW...

DYNAMIC RANDOM ACCESS MEMORY AND METHOD OF MANUFACTURING THE SAME

MEMORY DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

LANDING PAD STRUCTURE AND METHOD OF MANUFACTURING THE SAME

RESISTIVE RANDOM ACCESS MEMORY STRUCTURE AND MANUFACTURING METHOD T...