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Tzu-Shiun Sheu

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  • Hsin-Chu, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    • Publication number 20230187383
    • Publication date Jun 15, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yu-Wei Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    • Publication number 20220223542
    • Publication date Jul 14, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yu-Wei Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Chip-on-Substrate Packaging on Carrier
    • Publication number 20190115307
    • Publication date Apr 18, 2019
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Chip-on-Substrate Packaging on Carrier
    • Publication number 20180204810
    • Publication date Jul 19, 2018
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Chip-on-Substrate Packaging on Carrier
    • Publication number 20170098617
    • Publication date Apr 6, 2017
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Chip-on-Substrate Packaging on Carrier
    • Publication number 20150171034
    • Publication date Jun 18, 2015
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS