TZU-WEN PAN

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HSINCHU, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 12,132,050
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having dielectric structure extending into...
- Patent number 12,027,608
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 11,894,370
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 11,502,076
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 11,114,549
- Issue date Sep 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 10,325,912
- Issue date Jun 18, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20240371869
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNABLE W-SHAPED PROFILE FOR STRUCTURES
- Publication number 20240321739
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jih-Sheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING DIELECTRIC STRUCTURE EXTENDING INTO...
- Publication number 20240313091
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPATTERNING GATE PROCESSING
- Publication number 20240121935
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Y.L. Cheng
Information Patent Application
TUNABLE STRUCTURE PROFILE
- Publication number 20240120388
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Wei Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20240113112
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240096630
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Wei Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240072170
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Wei Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Forming the Same
- Publication number 20230027789
- Publication date Jan 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Wei Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20220384269
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20210280695
- Publication date Sep 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20190165137
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- RYAN CHIA-JEN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20190131298
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20190131297
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- RYAN CHIA-JEN CHEN
- H01 - BASIC ELECTRIC ELEMENTS

TZU-WEN PAN

Person

Patents Grantslast 30 patents

Semiconductor structure cutting process and structures formed thereby

Semiconductor structure having dielectric structure extending into...

Semiconductor structure cutting process and structures formed thereby

Semiconductor structure cutting process and structures formed thereby

Semiconductor structure cutting process and structures formed thereby

Semiconductor structure cutting process and structures formed thereby

Patents Applicationslast 30 patents

Semiconductor Structure Cutting Process and Structures Formed Thereby

TUNABLE W-SHAPED PROFILE FOR STRUCTURES

SEMICONDUCTOR STRUCTURE HAVING DIELECTRIC STRUCTURE EXTENDING INTO...

MULTIPATTERNING GATE PROCESSING

TUNABLE STRUCTURE PROFILE

Semiconductor Structure Cutting Process and Structures Formed Thereby

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

Semiconductor Devices and Methods of Forming the Same

Semiconductor Structure Cutting Process and Structures Formed Thereby

Semiconductor Structure Cutting Process and Structures Formed Thereby

Semiconductor Structure Cutting Process and Structures Formed Thereby

Semiconductor Structure Cutting Process and Structures Formed Thereby

Semiconductor Structure Cutting Process and Structures Formed Thereby