Tzu-Wen TSENG

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Xinpu Township, TW

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Patents Grantslast 30 patents

Information Patent Grant
Chip package including recess in side edge
- Patent number 9,601,460
- Issue date Mar 21, 2017
- XINTEC INC.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20150228536
- Publication date Aug 13, 2015
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS