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Patent Application
LIQUID COOLING VAPOR CHAMBER HEAT DISSIPATION MODULE
Publication number
20250003696
Publication date
Jan 2, 2025
TOP RANK TECHNOLOGY LIMITED
TIEN-LAI WANG
F28 - HEAT EXCHANGE IN GENERAL
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Patent Application
INTEGRATED HEAT DISSIPATION MODULE STRUCTURE
Publication number
20240298425
Publication date
Sep 5, 2024
TOP RANK TECHNOLOGY LIMITED
TIEN-LAI WANG
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
INTEGRATED VAPOR CHAMBER
Publication number
20240240873
Publication date
Jul 18, 2024
TOP RANK TECHNOLOGY LIMITED
TIEN-LAI WANG
F28 - HEAT EXCHANGE IN GENERAL