Tzung-Lung Lee

Person

Hsi Chih City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Dummy poly layout for high density devices
- Patent number 12,199,087
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung Feng Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 12,148,796
- Issue date Nov 19, 2024
- United Microelectronics Corp.
- Cheng-Pu Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out (InFO) package structure
- Patent number 12,094,830
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Che Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy poly layout for high density devices
- Patent number 11,881,477
- Issue date Jan 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung Feng Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method
- Patent number 11,855,014
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,848,233
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an integrated circuit package including an integra...
- Patent number 11,842,955
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,764,261
- Issue date Sep 19, 2023
- United Microelectronics Corp.
- Cheng-Pu Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply housing adapted to redundant power module
- Patent number 11,429,162
- Issue date Aug 30, 2022
- Zippy Technology Corp.
- Chun-Lung Su
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of making an integrated circuit package including an integra...
- Patent number 11,410,918
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,398,416
- Issue date Jul 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzung-Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out (info) package structure and method
- Patent number 11,393,763
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Che Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming same
- Patent number 11,289,410
- Issue date Mar 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,289,572
- Issue date Mar 29, 2022
- United Microelectronics Corp.
- Cheng-Pu Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,289,373
- Issue date Mar 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,217,518
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzung-Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor devices
- Patent number 11,062,984
- Issue date Jul 13, 2021
- Micron Technology, Inc.
- Tzung-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal gate structure and methods thereof
- Patent number 11,043,572
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tzung-Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of fabricating ESD FinFET with improved metal lan...
- Patent number 11,004,842
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tzung-Chi Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 10,867,793
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,867,941
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out packages and methods of forming the same
- Patent number 10,861,814
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzung-Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal gate structure and methods thereof
- Patent number 10,535,746
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzung-Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packae structure, RDL structure and method of forming the same
- Patent number 10,510,646
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tzung-Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 10,461,023
- Issue date Oct 29, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of fabricating ESD finFET with improved metal lan...
- Patent number 10,453,837
- Issue date Oct 22, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzung-Chi Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method
- Patent number 10,297,560
- Issue date May 21, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of fabricating ESD FinFET with improved metal lan...
- Patent number 10,276,559
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tzung-Chi Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dummy fin cell placement in an integrated circuit layout
- Patent number 10,204,202
- Issue date Feb 12, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tung-Heng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy fin cell placement in an integrated circuit layout
- Patent number 10,141,296
- Issue date Nov 27, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tung-Heng Hsieh
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250040198
- Publication date Jan 30, 2025
- UNITED MICROELECTRONICS CORP.
- Cheng-Pu Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240371778
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Che Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230395657
- Publication date Dec 7, 2023
- UNITED MICROELECTRONICS CORP.
- Cheng-Pu Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY POLY LAYOUT FOR HIGH DENSITY DEVICES
- Publication number 20220384416
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung Feng Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method of Making an Integrated Circuit Package Including an Integra...
- Publication number 20220328386
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT (INFO) PACKAGE STRUCTURE
- Publication number 20220310519
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Che Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220216103
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220165844
- Publication date May 26, 2022
- UNITED MICROELECTRONICS CORP.
- Cheng-Pu Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT (INFO) PACKAGE STRUCTURE AND METHOD
- Publication number 20210375767
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Che Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY POLY LAYOUT FOR HIGH DENSITY DEVICES
- Publication number 20210257351
- Publication date Aug 19, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Yung Feng Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER SUPPLY HOUSING ADAPTED TO REDUNDANT POWER MODULE
- Publication number 20210216115
- Publication date Jul 15, 2021
- ZIPPY TECHNOLOGY CORP.
- Chun-Lung SU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Device and Method
- Publication number 20210098397
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20210090973
- Publication date Mar 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzung-Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL GATE STRUCTURE AND METHODS THEREOF
- Publication number 20200152757
- Publication date May 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzung-Chi LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20200135453
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20200118914
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzung-Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method of Fabricating ESD FinFET With Improved Metal lan...
- Publication number 20200051972
- Publication date Feb 13, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Tzung-Chi Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200043782
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING SAME
- Publication number 20200013704
- Publication date Jan 9, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20190273055
- Publication date Sep 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAE STRUCTURE, RDL STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20190267314
- Publication date Aug 29, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzung-Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF FABRICATING ESD FINFET WITH IMPROVED METAL LAN...
- Publication number 20190252370
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzung-Chi Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Intergrated Circuit Packages and Methods of Forming Same
- Publication number 20190148274
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20190131223
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20190131269
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzung-Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190074246
- Publication date Mar 7, 2019
- Micron Technology, Inc.
- Tzung-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL GATE STRUCTURE AND METHODS THEREOF
- Publication number 20180331199
- Publication date Nov 15, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzung-Chi LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL GATE STRUCTURE AND METHODS THEREOF
- Publication number 20180182859
- Publication date Jun 28, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzung-Chi LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20180158789
- Publication date Jun 7, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING REDISTRIBUTION CIRCUIT STRUCTURE
- Publication number 20180151521
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzung-Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS

Tzung-Lung Lee

Person

Patents Grantslast 30 patents

Dummy poly layout for high density devices

Semiconductor device

Integrated fan-out (InFO) package structure

Dummy poly layout for high density devices

Semiconductor device and method

Semiconductor package and manufacturing method thereof

Method of making an integrated circuit package including an integra...

Semiconductor device

Power supply housing adapted to redundant power module

Method of making an integrated circuit package including an integra...

Package structure and method of fabricating the same

Integrated fan-out (info) package structure and method

Integrated circuit packages and methods of forming same

Semiconductor device

Semiconductor package and manufacturing method thereof

Package structure and method of forming the same

Methods for forming semiconductor devices

Metal gate structure and methods thereof

System and method of fabricating ESD FinFET with improved metal lan...

Semiconductor package and method of fabricating the same

Semiconductor device and method

Integrated fan-out packages and methods of forming the same

Metal gate structure and methods thereof

Packae structure, RDL structure and method of forming the same

Semiconductor packages and methods of forming the same

System and method of fabricating ESD finFET with improved metal lan...

Semiconductor device and method

System and method of fabricating ESD FinFET with improved metal lan...

Dummy fin cell placement in an integrated circuit layout

Dummy fin cell placement in an integrated circuit layout

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE

DUMMY POLY LAYOUT FOR HIGH DENSITY DEVICES

Method of Making an Integrated Circuit Package Including an Integra...

INTEGRATED FAN-OUT (INFO) PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

INTEGRATED FAN-OUT (INFO) PACKAGE STRUCTURE AND METHOD

DUMMY POLY LAYOUT FOR HIGH DENSITY DEVICES

POWER SUPPLY HOUSING ADAPTED TO REDUNDANT POWER MODULE

Semiconductor Device and Method

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

METAL GATE STRUCTURE AND METHODS THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

System and Method of Fabricating ESD FinFET With Improved Metal lan...

SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING SAME

Semiconductor Device and Method

PACKAE STRUCTURE, RDL STRUCTURE AND METHOD OF FORMING THE SAME

SYSTEM AND METHOD OF FABRICATING ESD FINFET WITH IMPROVED METAL LAN...

Intergrated Circuit Packages and Methods of Forming Same

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

INTEGRATED FAN-OUT PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE

METAL GATE STRUCTURE AND METHODS THEREOF

METAL GATE STRUCTURE AND METHODS THEREOF

Semiconductor Device and Method

METHOD OF FABRICATING REDISTRIBUTION CIRCUIT STRUCTURE