Tzy-Kuang LEE

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Passivation layer and planarization layer and method of forming the...
- Patent number 12,051,622
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package component with stepped passivation layer
- Patent number 11,961,762
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor between two passivation layers with different etching rates
- Patent number 11,935,826
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer features
- Patent number 11,670,594
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Blocking structures on isolation structures
- Patent number 11,621,165
- Issue date Apr 4, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hsuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package component with stepped passivation layer
- Patent number 11,450,567
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Blocking structures on isolation structures
- Patent number 10,930,502
- Issue date Feb 23, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hsuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Blocking structures on isolation structures
- Patent number 10,283,361
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hsuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of monitoring and controlling temperature of semi...
- Patent number 10,156,478
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Chang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse structures and forming and operation methods thereof
- Patent number 9,934,925
- Issue date Apr 3, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Chou Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REDISTRIBUTION LAYER FEATURES
- Publication number 20240387380
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH PULL-IN PLANARIZATION LAYER AND METHOD...
- Publication number 20240379428
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPONENT WITH STEPPED PASSIVATION LAYER
- Publication number 20240222194
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR BETWEEN TWO PASSIVATION LAYERS WITH DIFFERENT ETCHING RATES
- Publication number 20230378052
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ming HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER FEATURES
- Publication number 20230307366
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY CAPACITOR
- Publication number 20230299124
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Jen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Blocking Structures on Isolation Structures
- Publication number 20230253204
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Hsuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivation Structure for Metal Pattern
- Publication number 20230052604
- Publication date Feb 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Hung Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure with Pull-in Planarization Layer and Method...
- Publication number 20220384259
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Component with Stepped Passivation Layer
- Publication number 20220336276
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER FEATURES
- Publication number 20220223536
- Publication date Jul 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor Between Two Passivation Layers With Different Etching Rates
- Publication number 20210375748
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ming HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Lines Having Nano Columns and Method Forming Same
- Publication number 20210375672
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manfacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Component with Stepped Passivation Layer
- Publication number 20210375675
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Blocking Structures on Isolation Structures
- Publication number 20210175071
- Publication date Jun 10, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Hsuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Blocking Structures on Isolation Structures
- Publication number 20190244807
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Hsuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Blocking Structures on Isolation Structures
- Publication number 20190164744
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hsuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUSE STRUCTURES AND FORMING AND OPERATION METHODS THEREOF
- Publication number 20170140891
- Publication date May 18, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Chou Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF MONITORING AND CONTROLLING TEMPERATURE OF SEMI...
- Publication number 20170074727
- Publication date Mar 16, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Chang LIU
- G01 - MEASURING TESTING

Tzy-Kuang LEE

Person

Patents Grantslast 30 patents

Passivation layer and planarization layer and method of forming the...

Package component with stepped passivation layer

Capacitor between two passivation layers with different etching rates

Redistribution layer features

Blocking structures on isolation structures

Package component with stepped passivation layer

Blocking structures on isolation structures

Blocking structures on isolation structures

System and method of monitoring and controlling temperature of semi...

Fuse structures and forming and operation methods thereof

Patents Applicationslast 30 patents

REDISTRIBUTION LAYER FEATURES

SEMICONDUCTOR STRUCTURE WITH PULL-IN PLANARIZATION LAYER AND METHOD...

PACKAGE COMPONENT WITH STEPPED PASSIVATION LAYER

CAPACITOR BETWEEN TWO PASSIVATION LAYERS WITH DIFFERENT ETCHING RATES

REDISTRIBUTION LAYER FEATURES

HIGH DENSITY CAPACITOR

Blocking Structures on Isolation Structures

Passivation Structure for Metal Pattern

Semiconductor Structure with Pull-in Planarization Layer and Method...

Package Component with Stepped Passivation Layer

REDISTRIBUTION LAYER FEATURES

Capacitor Between Two Passivation Layers With Different Etching Rates

Redistribution Lines Having Nano Columns and Method Forming Same

Package Component with Stepped Passivation Layer

Blocking Structures on Isolation Structures

Blocking Structures on Isolation Structures

Blocking Structures on Isolation Structures

FUSE STRUCTURES AND FORMING AND OPERATION METHODS THEREOF

SYSTEM AND METHOD OF MONITORING AND CONTROLLING TEMPERATURE OF SEMI...