TREA

U Tani

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  • Osaka, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Sputtering target material
    • Patent number 11,427,888
    • Issue date Aug 30, 2022
    • Mitsubishi Materials Corporation
    • Satoru Mori
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Grant

    High purity copper sputtering target material
    • Patent number 10,889,889
    • Issue date Jan 12, 2021
    • Mitsubishi Materials Corporation
    • Satoru Mori
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

  • Information Patent Application

    SPUTTERING TARGET MATERIAL
    • Publication number 20210010105
    • Publication date Jan 14, 2021
    • MITSUBISHI MATERIALS CORPORATION
    • Satoru Mori
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Application

    HIGH PURITY COPPER SPUTTERING TARGET MATERIAL
    • Publication number 20180237901
    • Publication date Aug 23, 2018
    • MITSUBISHI MATERIALS CORPORATION
    • Satoru Mori
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR