U-Ting Chen

Person

Wanluan Township, TW

People

Patents Grantslast 30 patents

Information Patent Grant
BSI image sensor and method of forming same
- Patent number 11,916,091
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC interconnect apparatus and method
- Patent number 11,798,916
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BSI image sensor and method of forming same
- Patent number 11,315,972
- Issue date Apr 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BSI image sensor and method of forming same
- Patent number 10,847,560
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked image sensor having a barrier layer
- Patent number 10,818,720
- Issue date Oct 27, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- U-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC interconnect apparatus and method
- Patent number 10,510,729
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices having conductive plu...
- Patent number 10,304,818
- Issue date May 28, 2019
- Taiwan Semiconductor Manufacturing Company
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked image sensor having a barrier layer
- Patent number 10,283,547
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- U-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BSI image sensor and method of forming same
- Patent number 10,269,843
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC interconnect apparatus and method
- Patent number 10,157,891
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC interconnect apparatus and method
- Patent number 10,056,353
- Issue date Aug 21, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BSI image sensor and method of forming same
- Patent number 9,917,121
- Issue date Mar 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC interconnect apparatus and method
- Patent number 9,754,925
- Issue date Sep 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor devices, methods of manufacture thereof, and semicondu...
- Patent number 9,748,304
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- U-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for connecting dies and methods of forming t...
- Patent number 9,553,020
- Issue date Jan 24, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked image sensor having a barrier layer
- Patent number 9,536,920
- Issue date Jan 3, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- U-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC interconnect apparatus and method
- Patent number 9,412,719
- Issue date Aug 9, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for connecting dies and methods of forming t...
- Patent number 9,406,712
- Issue date Aug 2, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for connecting dies and methods of forming t...
- Patent number 9,076,715
- Issue date Jul 7, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image device and methods of forming the same
- Patent number 9,040,891
- Issue date May 26, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- U-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method
- Patent number 9,041,206
- Issue date May 26, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scribe lines in wafers
- Patent number 8,952,497
- Issue date Feb 10, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- U-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3DIC Interconnect Apparatus and Method
- Publication number 20230378139
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF
- Publication number 20220208749
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BSI Image Sensor and Method of Forming Same
- Publication number 20210233945
- Publication date Jul 29, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BSI Image Sensor and Method of Forming Same
- Publication number 20210066357
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
- Publication number 20190279974
- Publication date Sep 12, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED IMAGE SENSOR HAVING A BARRIER LAYER
- Publication number 20190259799
- Publication date Aug 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- U-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BSI Image Sensor and Method of Forming Same
- Publication number 20190252423
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Interconnect Apparatus and Method
- Publication number 20190115322
- Publication date Apr 18, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Interconnect Apparatus and Method
- Publication number 20180366447
- Publication date Dec 20, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BSI Image Sensor and Method of Forming Same
- Publication number 20180197903
- Publication date Jul 12, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
- Publication number 20180102351
- Publication date Apr 12, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Interconnect Apparatus and Method
- Publication number 20180012870
- Publication date Jan 11, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BSI Image Sensor and Method of Forming Same
- Publication number 20170278881
- Publication date Sep 28, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Image Sensor Having a Barrier Layer
- Publication number 20170110497
- Publication date Apr 20, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- U-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Interconnect Apparatus and Method
- Publication number 20160351546
- Publication date Dec 1, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR CONNECTING DIES AND METHODS OF FORMING T...
- Publication number 20160336231
- Publication date Nov 17, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure for Connecting Dies and Methods of Forming t...
- Publication number 20150287757
- Publication date Oct 8, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Image Sensor Having a Barrier Layer
- Publication number 20150279891
- Publication date Oct 1, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- U-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
- Publication number 20150187701
- Publication date Jul 2, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Interconnect Apparatus and Method
- Publication number 20150179613
- Publication date Jun 25, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Interconnect Apparatus and Method
- Publication number 20150179612
- Publication date Jun 25, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensor Devices, Methods of Manufacture Thereof, and Semicondu...
- Publication number 20150171132
- Publication date Jun 18, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- U-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure for Connecting Dies and Methods of Forming t...
- Publication number 20140264709
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method
- Publication number 20140264862
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Scribe Lines in Wafers
- Publication number 20140077320
- Publication date Mar 20, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- U-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE DEVICE AND METHODS OF FORMING THE SAME
- Publication number 20130327921
- Publication date Dec 12, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- U-Ting CHEN
- H01 - BASIC ELECTRIC ELEMENTS

U-Ting Chen

Person

Patents Grantslast 30 patents

BSI image sensor and method of forming same

3DIC interconnect apparatus and method

BSI image sensor and method of forming same

BSI image sensor and method of forming same

Stacked image sensor having a barrier layer

3DIC interconnect apparatus and method

Method of manufacturing semiconductor devices having conductive plu...

Stacked image sensor having a barrier layer

BSI image sensor and method of forming same

3DIC interconnect apparatus and method

3DIC interconnect apparatus and method

BSI image sensor and method of forming same

3DIC interconnect apparatus and method

Image sensor devices, methods of manufacture thereof, and semicondu...

Interconnect structure for connecting dies and methods of forming t...

Stacked image sensor having a barrier layer

3DIC interconnect apparatus and method

Interconnect structure for connecting dies and methods of forming t...

Interconnect structure for connecting dies and methods of forming t...

Image device and methods of forming the same

Interconnect structure and method

Scribe lines in wafers

Patents Applicationslast 30 patents

3DIC Interconnect Apparatus and Method

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF

BSI Image Sensor and Method of Forming Same

BSI Image Sensor and Method of Forming Same

Semiconductor Devices and Methods of Manufacture Thereof

STACKED IMAGE SENSOR HAVING A BARRIER LAYER

BSI Image Sensor and Method of Forming Same

3DIC Interconnect Apparatus and Method

3DIC Interconnect Apparatus and Method

BSI Image Sensor and Method of Forming Same

Semiconductor Devices and Methods of Manufacture Thereof

3DIC Interconnect Apparatus and Method

BSI Image Sensor and Method of Forming Same

Stacked Image Sensor Having a Barrier Layer

3DIC Interconnect Apparatus and Method

INTERCONNECT STRUCTURE FOR CONNECTING DIES AND METHODS OF FORMING T...

Interconnect Structure for Connecting Dies and Methods of Forming t...

Stacked Image Sensor Having a Barrier Layer

Semiconductor Devices and Methods of Manufacture Thereof

3DIC Interconnect Apparatus and Method

3DIC Interconnect Apparatus and Method

Image Sensor Devices, Methods of Manufacture Thereof, and Semicondu...

Interconnect Structure for Connecting Dies and Methods of Forming t...

Interconnect Structure and Method

Scribe Lines in Wafers

IMAGE DEVICE AND METHODS OF FORMING THE SAME