Uei-Ming JOW

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Display module excitation for wireless communications
- Patent number 11,688,927
- Issue date Jun 27, 2023
- Google LLC
- Sung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned grounds and methods of forming the same
- Patent number 10,109,584
- Issue date Oct 23, 2018
- QUALCOMM Incorporated
- Uei-Ming Jow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip employing integrated cavity filter, and related component...
- Patent number 9,812,752
- Issue date Nov 7, 2017
- QUALCOMM Incorporated
- John Jong-Hoon Lee
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Multi-layer ground shield structure of interconnected elements
- Patent number 9,691,720
- Issue date Jun 27, 2017
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising stacks of interconnects, interconnect on solde...
- Patent number 9,691,694
- Issue date Jun 27, 2017
- QUALCOMM Incorporated
- Uei-Ming Jow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer interconnected spiral capacitor
- Patent number 9,653,533
- Issue date May 16, 2017
- QUALCOMM Incorporated
- Uei-Ming Jow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor structure in a semiconductor device
- Patent number 9,576,718
- Issue date Feb 21, 2017
- QUALCOMM Incorporated
- Uei-Ming Jow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip employing integrated cavity filter, and related component...
- Patent number 9,443,810
- Issue date Sep 13, 2016
- QUALCOMM Incorporated
- John Jong-Hoon Lee
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High quality factor filter implemented in wafer level packaging (WL...
- Patent number 9,373,583
- Issue date Jun 21, 2016
- QUALCOMM Incorporated
- Jong-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package (PoP) integrated device comprising a capacitor i...
- Patent number 9,368,566
- Issue date Jun 14, 2016
- QUALCOMM Incorporated
- Jong-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High quality factor inductor and high quality factor filter in pack...
- Patent number 9,247,647
- Issue date Jan 26, 2016
- QUALCOMM Incorporated
- Jung Ho Yoon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ANTENNA EXCITATION THROUGH LAPTOP HINGE
- Publication number 20230101668
- Publication date Mar 30, 2023
- Google LLC
- Sung Oh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPLAY MODULE EXCITATION FOR WIRELESS COMMUNICATIONS
- Publication number 20210066781
- Publication date Mar 4, 2021
- Google LLC
- Sung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE PACKAGE WITH PASSIVE DEVICE
- Publication number 20170092594
- Publication date Mar 30, 2017
- QUALCOMM Incorporated
- Young Kyu SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP EMPLOYING INTEGRATED CAVITY FILTER, AND RELATED COMPONENT...
- Publication number 20170077574
- Publication date Mar 16, 2017
- QUALCOMM Incorporated
- John Jong-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER GROUND SHIELD STRUCTURE OF INTERCONNECTED ELEMENTS
- Publication number 20170033059
- Publication date Feb 2, 2017
- QUALCOMM Incorporated
- Young Kyu SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR STRUCTURE IN A SEMICONDUCTOR DEVICE
- Publication number 20160372253
- Publication date Dec 22, 2016
- QUALCOMM Incorporated
- Uei-Ming Jow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER INTERCONNECTED SPIRAL CAPACITOR
- Publication number 20160240606
- Publication date Aug 18, 2016
- QUALCOMM Incorporated
- Uei-Ming JOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE COMPRISING STACKS OF INTERCONNECTS, INTERCONNECT ON SOLDE...
- Publication number 20160240463
- Publication date Aug 18, 2016
- QUALCOMM Incorporated
- Uei-Ming Jow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, APPARATUS, AND METHOD FOR SEMICONDUCTOR PACKAGE GROUNDS
- Publication number 20160172274
- Publication date Jun 16, 2016
- QUALCOMM Incorporated
- Jung Ho YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED GROUNDS AND METHODS OF FORMING THE SAME
- Publication number 20160066414
- Publication date Mar 3, 2016
- QUALCOMM Incorporated
- Uei-Ming JOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE (PoP) INTEGRATED DEVICE COMPRISING A CAPACITOR I...
- Publication number 20160020193
- Publication date Jan 21, 2016
- QUALCOMM Incorporated
- Jong-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH QUALITY FACTOR FILTER IMPLEMENTED IN WAFER LEVEL PACKAGING (WL...
- Publication number 20140319652
- Publication date Oct 30, 2014
- Jong-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS

Uei-Ming JOW

Person

Patents Grantslast 30 patents

Display module excitation for wireless communications

Patterned grounds and methods of forming the same

Flip-chip employing integrated cavity filter, and related component...

Multi-layer ground shield structure of interconnected elements

Substrate comprising stacks of interconnects, interconnect on solde...

Multi-layer interconnected spiral capacitor

Inductor structure in a semiconductor device

Flip-chip employing integrated cavity filter, and related component...

High quality factor filter implemented in wafer level packaging (WL...

Package on package (PoP) integrated device comprising a capacitor i...

High quality factor inductor and high quality factor filter in pack...

Patents Applicationslast 30 patents

ANTENNA EXCITATION THROUGH LAPTOP HINGE

DISPLAY MODULE EXCITATION FOR WIRELESS COMMUNICATIONS

LOW PROFILE PACKAGE WITH PASSIVE DEVICE

FLIP-CHIP EMPLOYING INTEGRATED CAVITY FILTER, AND RELATED COMPONENT...

MULTI-LAYER GROUND SHIELD STRUCTURE OF INTERCONNECTED ELEMENTS

INDUCTOR STRUCTURE IN A SEMICONDUCTOR DEVICE

MULTI-LAYER INTERCONNECTED SPIRAL CAPACITOR

SUBSTRATE COMPRISING STACKS OF INTERCONNECTS, INTERCONNECT ON SOLDE...

SYSTEM, APPARATUS, AND METHOD FOR SEMICONDUCTOR PACKAGE GROUNDS

PATTERNED GROUNDS AND METHODS OF FORMING THE SAME

PACKAGE ON PACKAGE (PoP) INTEGRATED DEVICE COMPRISING A CAPACITOR I...

HIGH QUALITY FACTOR FILTER IMPLEMENTED IN WAFER LEVEL PACKAGING (WL...