Ui Yamaguchi

Person

Toyota, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Picture recorder and commercial message detection method
- Patent number 8,306,397
- Issue date Nov 6, 2012
- Hitachi, Ltd.
- Ui Yamaguchi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Content delivery method, server, and terminal
- Patent number 8,112,503
- Issue date Feb 7, 2012
- Hitachi, Ltd.
- Nobuhiro Sekimoto
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for manufacturing semiconductor device and apparatus for man...
- Patent number 7,144,298
- Issue date Dec 5, 2006
- Hitachi, Ltd.
- Souichi Katagiri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device and apparatus for man...
- Patent number 6,908,860
- Issue date Jun 21, 2005
- Hitachi, Ltd.
- Souichi Katagiri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a semiconductor device that includes plana...
- Patent number 6,849,542
- Issue date Feb 1, 2005
- Hitachi, Ltd.
- Soichi Katagiri
- B24 - GRINDING POLISHING
Information Patent Grant
Planarizing method of semiconductor wafer and apparatus thereof
- Patent number 6,777,337
- Issue date Aug 17, 2004
- Renesas Technology Corporation
- Kan Yasui
- B24 - GRINDING POLISHING
Information Patent Grant
Method of polishing a semiconductor device
- Patent number 6,734,103
- Issue date May 11, 2004
- Hitachi, Ltd.
- Souichi Katagiri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for polishing surface of semiconductor device substrate
- Patent number 6,663,468
- Issue date Dec 16, 2003
- Hitachi, Ltd.
- Yoshio Kawamura
- B24 - GRINDING POLISHING
Information Patent Grant
Processing method, measuring method and producing method of semicon...
- Patent number 6,589,871
- Issue date Jul 8, 2003
- Hitachi, Ltd.
- Yoshio Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for planarizing semiconductor device
- Patent number 6,565,424
- Issue date May 20, 2003
- Hitachi, Ltd.
- Souichi Katagiri
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
CONTENT DELIVERY METHOD, SERVER, AND TERMINAL
- Publication number 20090138576
- Publication date May 28, 2009
- Nobuhiro SEKIMOTO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PICTURE RECORDER AND COMMERCIAL MESSAGE DETECTION METHOD
- Publication number 20080075427
- Publication date Mar 27, 2008
- Ui Yamaguchi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method for manufacturing semiconductor device and apparatus for man...
- Publication number 20050221608
- Publication date Oct 6, 2005
- Souichi Katagiri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for polishing surface of semiconductor device substrate
- Publication number 20040048554
- Publication date Mar 11, 2004
- Hitachi, Ltd.
- Yoshio Kawamura
- B24 - GRINDING POLISHING
Information Patent Application
Method for manufacturing semiconductor device and apparatus for man...
- Publication number 20040043608
- Publication date Mar 4, 2004
- Souichi Katagiri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method of semiconductor device and apparatus thereof
- Publication number 20030077906
- Publication date Apr 24, 2003
- Soichi Katagiri
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for manufacturing semiconductor device
- Publication number 20020160609
- Publication date Oct 31, 2002
- Souichi Katagiri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Processing method, measuring method and producing method of semicon...
- Publication number 20020076933
- Publication date Jun 20, 2002
- Hitachi, Ltd.
- Yoshio Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for planarizing semiconductor device
- Publication number 20020049026
- Publication date Apr 25, 2002
- Souichi Katagiri
- B24 - GRINDING POLISHING
Information Patent Application
Planarizing method of semiconductor wafer and apparatus thereof
- Publication number 20020028581
- Publication date Mar 7, 2002
- HITACHI LTD.
- Kan Yasui
- B24 - GRINDING POLISHING
Information Patent Application
Method for polishing surface of semicon-ductor device substrate
- Publication number 20010007795
- Publication date Jul 12, 2001
- Yoshio Kawamura
- B24 - GRINDING POLISHING

Ui Yamaguchi

Person

Patents Grantslast 30 patents

Picture recorder and commercial message detection method

Content delivery method, server, and terminal

Method for manufacturing semiconductor device and apparatus for man...

Method for manufacturing semiconductor device and apparatus for man...

Method for manufacturing a semiconductor device that includes plana...

Planarizing method of semiconductor wafer and apparatus thereof

Method of polishing a semiconductor device

Method for polishing surface of semiconductor device substrate

Processing method, measuring method and producing method of semicon...

Method and apparatus for planarizing semiconductor device

Patents Applicationslast 30 patents

CONTENT DELIVERY METHOD, SERVER, AND TERMINAL

PICTURE RECORDER AND COMMERCIAL MESSAGE DETECTION METHOD

Method for manufacturing semiconductor device and apparatus for man...

Method for polishing surface of semiconductor device substrate

Method for manufacturing semiconductor device and apparatus for man...

Manufacturing method of semiconductor device and apparatus thereof

Method and apparatus for manufacturing semiconductor device

Processing method, measuring method and producing method of semicon...

Method and apparatus for planarizing semiconductor device

Planarizing method of semiconductor wafer and apparatus thereof

Method for polishing surface of semicon-ductor device substrate