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Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP PACKAGE THERMO-MECHANICAL COOLING ASSEMBLY
- Publication number 20220208645
- Publication date Jun 30, 2022
- Intel Corporation
- Olaotan ELENITOBA-JOHNSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRAMEWORK INCLUDING AN INTERPOSER HAVING AN ATYPICAL SHAPE
- Publication number 20220094094
- Publication date Mar 24, 2022
- Intel Corporation
- Ulises Encarnacion
- H01 - BASIC ELECTRIC ELEMENTS