Ulrich FROEHLER

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Nersingen, DE

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package comprising side walls connected with c...
- Patent number 11,978,693
- Issue date May 7, 2024
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing an SMD package with top side cooling
- Patent number 10,903,133
- Issue date Jan 26, 2021
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SMD package with top side cooling
- Patent number 10,566,260
- Issue date Feb 18, 2020
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 9,748,116
- Issue date Aug 29, 2017
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device Package Comprising Side Walls Connected with C...
- Publication number 20220037240
- Publication date Feb 3, 2022
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Producing an SMD Package with Top Side Cooling
- Publication number 20200144150
- Publication date May 7, 2020
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMD Package with Top Side Cooling
- Publication number 20190080980
- Publication date Mar 14, 2019
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device and method of manufacturing the same
- Publication number 20170005025
- Publication date Jan 5, 2017
- Infineon Technologies Austria AG
- Ralf OTREMBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device and method of manufacturing the same
- Publication number 20160379919
- Publication date Dec 29, 2016
- Infineon Technologies Austria AG
- Ralf OTREMBA
- H01 - BASIC ELECTRIC ELEMENTS