Ulrich Vidal

Follow

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Multichip module for LOC mounting and method for producing the mult...
- Patent number 7,276,781
- Issue date Oct 2, 2007
- Infineon Technologies AG
- Klemens Ferstl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of positioning a component mounted on a lead frame in a test...
- Patent number 6,541,311
- Issue date Apr 1, 2003
- Infineon Technologies AG
- Christian Hauser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite member composed of at least two integrated circuits and m...
- Patent number 6,262,476
- Issue date Jul 17, 2001
- Siemens Aktiengesellschaft
- Ulrich Vidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe for semiconductor chips and semiconductor module having t...
- Patent number 6,144,088
- Issue date Nov 7, 2000
- Infineon Technologies AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multichip module for LOC mounting and method for producing the mult...
- Publication number 20020079559
- Publication date Jun 27, 2002
- Klemens Ferstl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit, casting mold for producing an integrated module...
- Publication number 20020024126
- Publication date Feb 28, 2002
- Christian Hauser
- H01 - BASIC ELECTRIC ELEMENTS