Ulrich Wachter

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method of packaging integrated circuits
- Patent number 9,806,056
- Issue date Oct 31, 2017
- Infineon Technologies AG
- Ulrich Wachter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package arrangement, a package, and a method of manufacturing a pac...
- Patent number 9,718,678
- Issue date Aug 1, 2017
- Infineon Technologies AG
- Ulrich Wachter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package arrangement including external block comprising semiconduct...
- Patent number 9,711,462
- Issue date Jul 18, 2017
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging
- Patent number 9,620,457
- Issue date Apr 11, 2017
- Infineon Technologies AG
- Ulrich Wachter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of packaging integrated circuits and a molded package
- Patent number 9,487,392
- Issue date Nov 8, 2016
- Infineon Technologies AG
- Ulrich Wachter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Metal redistribution layer for molded substrates
- Patent number 9,275,878
- Issue date Mar 1, 2016
- Infineon Technologies AG
- Ulrich Wachter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a plurality of semiconductor devices
- Patent number 9,147,585
- Issue date Sep 29, 2015
- Infineon Technologies AG
- Thomas Kilger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package with backside die metallization
- Patent number 9,099,454
- Issue date Aug 4, 2015
- Infineon Technologies AG
- Ulrich Wachter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a chip package
- Patent number 8,912,087
- Issue date Dec 16, 2014
- Infineon Technologies AG
- Josef Hirtreiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor device
- Patent number 8,906,749
- Issue date Dec 9, 2014
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,890,284
- Issue date Nov 18, 2014
- Infineon Technologies AG
- Thomas Kilger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging integrated circuits and a molded substrate with...
- Patent number 8,828,807
- Issue date Sep 9, 2014
- Infineon Technologies AG
- Ulrich Wachter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a method for manufacturing a chip package
- Patent number 8,669,655
- Issue date Mar 11, 2014
- Infineon Technologies AG
- Ottmar Geitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconfigured wafer alignment
- Patent number 7,943,423
- Issue date May 17, 2011
- Infineon Technologies AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of Packaging Integrated Circuits
- Publication number 20160163674
- Publication date Jun 9, 2016
- INFINEON TECHNOLOGIES AG
- Ulrich Wachter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARRANGEMENT, A PACKAGE, AND A METHOD OF MANUFACTURING A PAC...
- Publication number 20160090294
- Publication date Mar 31, 2016
- INFINEON TECHNOLOGIES AG
- Ulrich Wachter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FORMING A PACKAGE ARRANGEMENT AND PACKAGE ARRANGEMENT
- Publication number 20160035677
- Publication date Feb 4, 2016
- INFINEON TECHNOLOGIES AG
- Ulrich Wachter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Packaging
- Publication number 20150145149
- Publication date May 28, 2015
- INFINEON TECHNOLOGIES AG
- Ulrich Wachter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Redistribution Layer for Molded Substrates
- Publication number 20150091171
- Publication date Apr 2, 2015
- INFINEON TECHNOLOGIES AG
- Ulrich Wachter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20150064846
- Publication date Mar 5, 2015
- INFINEON TECHNOLOGIES AG
- Thomas Kilger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Semiconductor Package with Backside Die Metallization
- Publication number 20150041967
- Publication date Feb 12, 2015
- INFINEON TECHNOLOGIES AG
- Ulrich Wachter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Packaging Integrated Circuits and a Molded Package
- Publication number 20150028435
- Publication date Jan 29, 2015
- INFINEON TECHNOLOGIES AG
- Ulrich Wachter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE ARRANGEMENT AND METHOD OF FORMING THE SAME
- Publication number 20140332936
- Publication date Nov 13, 2014
- INFINEON TECHNOLOGIES AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140239438
- Publication date Aug 28, 2014
- INFINEON TECHNOLOGIES AG
- Thomas Kilger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140035154
- Publication date Feb 6, 2014
- INFINEON TECHNOLOGIES AG
- Ottmar Geitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140035127
- Publication date Feb 6, 2014
- INFINEON TECHNOLOGIES AG
- Josef Hirtreiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Semiconductor Device
- Publication number 20130256922
- Publication date Oct 3, 2013
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONFIGURED WAFER ALIGNMENT
- Publication number 20100233831
- Publication date Sep 16, 2010
- INFINEON TECHNOLOGIES AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS

Ulrich Wachter

Person

Patents Grantslast 30 patents

Method of packaging integrated circuits

Package arrangement, a package, and a method of manufacturing a pac...

Package arrangement including external block comprising semiconduct...

Semiconductor device packaging

Method of packaging integrated circuits and a molded package

Metal redistribution layer for molded substrates

Method for fabricating a plurality of semiconductor devices

Molded semiconductor package with backside die metallization

Method of fabricating a chip package

Method for fabricating a semiconductor device

Semiconductor device

Method of packaging integrated circuits and a molded substrate with...

Chip package and a method for manufacturing a chip package

Reconfigured wafer alignment

Patents Applicationslast 30 patents

Method of Packaging Integrated Circuits

PACKAGE ARRANGEMENT, A PACKAGE, AND A METHOD OF MANUFACTURING A PAC...

METHOD FOR FORMING A PACKAGE ARRANGEMENT AND PACKAGE ARRANGEMENT

Semiconductor Device Packaging

Metal Redistribution Layer for Molded Substrates

Semiconductor Device

Molded Semiconductor Package with Backside Die Metallization

Method of Packaging Integrated Circuits and a Molded Package

PACKAGE ARRANGEMENT AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE

Method for Fabricating a Semiconductor Device

RECONFIGURED WAFER ALIGNMENT