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Ung Hui SHIN

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  • Suwon-si, KR
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Patents Grantslast 30 patents

  • Information Patent Grant

    Fan-out semiconductor package
    • Patent number 10,515,916
    • Issue date Dec 24, 2019
    • Samsung Electronics Co., Ltd.
    • Dae Jung Byun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Printed circuit board
    • Patent number 10,448,512
    • Issue date Oct 15, 2019
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Doo Hwan Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Fan-out semiconductor package
    • Patent number 10,157,868
    • Issue date Dec 18, 2018
    • Samsung Electro-Mechanics Co., Ltd.
    • Dae Jung Byun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic component package and method of manufacturing the same
    • Patent number 9,929,100
    • Issue date Mar 27, 2018
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Doo Hwan Lee
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents