Ungcheon Kim

Person

Cheonan-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Interposer, method for fabricating the same, and semiconductor pack...
- Patent number 11,984,415
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,848,307
- Issue date Dec 19, 2023
- Samsung Electronics Co., Ltd.
- Sungwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and semiconductor package including same
- Patent number 11,728,255
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Ungcheon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer, semiconductor package including the same, and method of...
- Patent number 11,482,483
- Issue date Oct 25, 2022
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACK...
- Publication number 20240274553
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING SAME
- Publication number 20230352386
- Publication date Nov 2, 2023
- Samsung Electronics Co., Ltd.
- Ungcheon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF...
- Publication number 20230052195
- Publication date Feb 16, 2023
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACK...
- Publication number 20220302053
- Publication date Sep 22, 2022
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220199577
- Publication date Jun 23, 2022
- Samsung Electronics Co., Ltd.
- Sungwoo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING SAME
- Publication number 20220013445
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Ungcheon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF...
- Publication number 20210175161
- Publication date Jun 10, 2021
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS

Ungcheon Kim

Person

Patents Grantslast 30 patents

Interposer, method for fabricating the same, and semiconductor pack...

Semiconductor package

Interposer and semiconductor package including same

Interposer, semiconductor package including the same, and method of...

Patents Applicationslast 30 patents

INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACK...

INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING SAME

INTERPOSER, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF...

INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACK...

SEMICONDUCTOR PACKAGE

INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING SAME

INTERPOSER, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF...