Urusa ALAAN

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Gate-to-gate isolation for stacked transistor architecture via sele...
- Patent number 12,369,399
- Issue date Jul 22, 2025
- Intel Corporation
- Willy Rachmady
Information Patent Grant
Thin film transistors having semiconductor structures integrated wi...
- Patent number 12,349,442
- Issue date Jul 1, 2025
- Intel Corporation
- Ashish Verma Penumatcha
Information Patent Grant
ESD protection decoupled from diffusion
- Patent number 12,328,946
- Issue date Jun 10, 2025
- Intel Corporation
- Urusa Alaan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Transistors including two-dimensional materials
- Patent number 12,324,204
- Issue date Jun 3, 2025
- Intel Corporation
- Carl Hugo Naylor
Information Patent Grant
Integrated circuits and methods for forming thin film crystal layers
- Patent number 12,211,794
- Issue date Jan 28, 2025
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor channel passivation with 2D crystalline material
- Patent number 12,107,170
- Issue date Oct 1, 2024
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic memory stack
- Patent number 12,058,847
- Issue date Aug 6, 2024
- Intel Corporation
- Prashant Majhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures having linerless self-forming barriers
- Patent number 12,057,388
- Issue date Aug 6, 2024
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked forksheet transistors
- Patent number 11,996,411
- Issue date May 28, 2024
- Intel Corporation
- Cheng-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistors with metal chalcogenide channel materials
- Patent number 11,888,034
- Issue date Jan 30, 2024
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods for forming integrated circuits
- Patent number 11,830,788
- Issue date Nov 28, 2023
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectable vias for back end of line interconnects
- Patent number 11,670,588
- Issue date Jun 6, 2023
- Intel Corporation
- Christopher Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically stacked memory elements with air gap
- Patent number 11,672,133
- Issue date Jun 6, 2023
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around integrated circuit structures having fin stack isol...
- Patent number 11,594,637
- Issue date Feb 28, 2023
- Intel Corporation
- Leonard P. Guler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Local interconnect with air gap
- Patent number 11,594,485
- Issue date Feb 28, 2023
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device with air-gaps to reduce coupling capacitance and process for...
- Patent number 11,574,910
- Issue date Feb 7, 2023
- Intel Corporation
- Abhishek Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-planar transistors with channel regions having varying widths
- Patent number 11,569,231
- Issue date Jan 31, 2023
- Intel Corporation
- Stephen D Snyder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion structure for thin film transistor
- Patent number 11,482,622
- Issue date Oct 25, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods for forming thin film crystal layers
- Patent number 11,276,644
- Issue date Mar 15, 2022
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor channel passivation with 2D crystalline material
- Patent number 11,171,239
- Issue date Nov 9, 2021
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods for forming integrated circuits
- Patent number 11,164,809
- Issue date Nov 2, 2021
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods for forming integrated circuits
- Patent number 11,018,075
- Issue date May 25, 2021
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED FORKSHEET TRANSISTORS
- Publication number 20240234422
- Publication date Jul 11, 2024
- Intel Corporation
- Cheng-Ying HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DEVICES WITH HIGH-K PEROVSKITE GATE DIELECTRICS
- Publication number 20230253476
- Publication date Aug 10, 2023
- Intel Corporation
- Arnab Sen Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TRANSISTORS WITH REMOVED EPI BARRIER
- Publication number 20230187509
- Publication date Jun 15, 2023
- Intel Corporation
- Urusa Alaan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING FIN STACK ISOL...
- Publication number 20230163215
- Publication date May 25, 2023
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATTICE STACK FOR INTERNAL SPACER FABRICATION
- Publication number 20230134379
- Publication date May 4, 2023
- Intel Corporation
- Cheng-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTORS HAVING CMOS FUNCTIONALITY INTEGRATED WITH 2D...
- Publication number 20230113614
- Publication date Apr 13, 2023
- Intel Corporation
- Kevin P. O'BRIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES WITH CONDUCTIVE TRENCH CONTACT...
- Publication number 20230095402
- Publication date Mar 30, 2023
- Intel Corporation
- Manish CHANDHOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES WITH CONDUCTIVE TRENCH CONTACT...
- Publication number 20230101212
- Publication date Mar 30, 2023
- Intel Corporation
- Manish CHANDHOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTORS HAVING SEMICONDUCTOR STRUCTURES INTEGRATED WI...
- Publication number 20230090093
- Publication date Mar 23, 2023
- Intel Corporation
- Ashish Verma PENUMATCHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MEMORY STRUCTURE WITH DUAL-CHANNEL TRANSISTOR
- Publication number 20230081882
- Publication date Mar 16, 2023
- Intel Corporation
- Sean T. Ma
- G11 - INFORMATION STORAGE
Information Patent Application
GATE-TO-GATE ISOLATION FOR STACKED TRANSISTOR ARCHITECTURE VIA SELE...
- Publication number 20230073078
- Publication date Mar 9, 2023
- Intel Corporation
- Willy Rachmady
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITIONAL ENGINEERING OF SCHOTTKY DIODE
- Publication number 20220199839
- Publication date Jun 23, 2022
- Intel Corporation
- Arnab SEN GUPTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL METHOD TO FORM SINGLE CRYSTAL MOSFET AND FEFET
- Publication number 20220199801
- Publication date Jun 23, 2022
- Intel Corporation
- Prashant MAJHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL ESD PROTECTION DECOUPLED FROM DIFFUSION
- Publication number 20220199609
- Publication date Jun 23, 2022
- Intel Corporation
- Urusa ALAAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuits and Methods for Forming Thin Film Crystal Layers
- Publication number 20220148917
- Publication date May 12, 2022
- Intel Corporation
- Carl NAYLOR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTORS INCLUDING TWO-DIMENSIONAL MATERIALS
- Publication number 20220102499
- Publication date Mar 31, 2022
- Intel Corporation
- Carl Hugo Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAMASCENE INTERCONNECT STRUCTURES WITH LOW RESISTANCE VIAS FOR INTE...
- Publication number 20220102268
- Publication date Mar 31, 2022
- Intel Corporation
- Urusa Alaan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR CHANNEL PASSIVATION WITH 2D CRYSTALLINE MATERIAL
- Publication number 20220059702
- Publication date Feb 24, 2022
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FORKSHEET TRANSISTORS
- Publication number 20210407999
- Publication date Dec 30, 2021
- Intel Corporation
- Cheng-Ying HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC MEMORY STACK
- Publication number 20210375873
- Publication date Dec 2, 2021
- Intel Corporation
- Prashant Majhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS AND METHODS FOR FORMING INTEGRATED CIRCUITS
- Publication number 20210351105
- Publication date Nov 11, 2021
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING FIN STACK ISOL...
- Publication number 20210305430
- Publication date Sep 30, 2021
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING LINERLESS SELF-FORMING BARRIERS
- Publication number 20210090991
- Publication date Mar 25, 2021
- Intel Corporation
- Abhishek A. SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR CHANNEL PASSIVATION WITH 2D CRYSTALLINE MATERIAL
- Publication number 20210083122
- Publication date Mar 18, 2021
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH AIR-GAPS TO REDUCE COUPLING CAPACITANCE AND PROCESS FOR...
- Publication number 20200411526
- Publication date Dec 31, 2020
- Intel Corporation
- Abhishek SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY STACKED MEMORY ELEMENTS WITH AIR GAP
- Publication number 20200403033
- Publication date Dec 24, 2020
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL INTERCONNECT WITH AIR GAP
- Publication number 20200388565
- Publication date Dec 10, 2020
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTORS WITH METAL CHALCOGENIDE CHANNEL MATERIALS
- Publication number 20200388685
- Publication date Dec 10, 2020
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-PLANAR TRANSISTORS WITH CHANNEL REGIONS HAVING VARYING WIDTHS
- Publication number 20200295002
- Publication date Sep 17, 2020
- Intel Corporation
- Stephen D. Snyder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTABLE VIAS FOR BACK END OF LINE INTERCONNECTS
- Publication number 20200219804
- Publication date Jul 9, 2020
- Intel Corporation
- Christopher Jezewski
- H01 - BASIC ELECTRIC ELEMENTS

Urusa ALAAN

Person

Patents Grantslast 30 patents

Gate-to-gate isolation for stacked transistor architecture via sele...

Thin film transistors having semiconductor structures integrated wi...

ESD protection decoupled from diffusion

Transistors including two-dimensional materials

Integrated circuits and methods for forming thin film crystal layers

Transistor channel passivation with 2D crystalline material

Monolithic memory stack

Integrated circuit structures having linerless self-forming barriers

Stacked forksheet transistors

Transistors with metal chalcogenide channel materials

Integrated circuits and methods for forming integrated circuits

Selectable vias for back end of line interconnects

Vertically stacked memory elements with air gap

Gate-all-around integrated circuit structures having fin stack isol...

Local interconnect with air gap

Device with air-gaps to reduce coupling capacitance and process for...

Non-planar transistors with channel regions having varying widths

Adhesion structure for thin film transistor

Integrated circuits and methods for forming thin film crystal layers

Transistor channel passivation with 2D crystalline material

Integrated circuits and methods for forming integrated circuits

Integrated circuits and methods for forming integrated circuits

Patents Applicationslast 30 patents

STACKED FORKSHEET TRANSISTORS

TRANSISTOR DEVICES WITH HIGH-K PEROVSKITE GATE DIELECTRICS

STACKED TRANSISTORS WITH REMOVED EPI BARRIER

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING FIN STACK ISOL...

LATTICE STACK FOR INTERNAL SPACER FABRICATION

THIN FILM TRANSISTORS HAVING CMOS FUNCTIONALITY INTEGRATED WITH 2D...

CONTACT OVER ACTIVE GATE STRUCTURES WITH CONDUCTIVE TRENCH CONTACT...

CONTACT OVER ACTIVE GATE STRUCTURES WITH CONDUCTIVE TRENCH CONTACT...

THIN FILM TRANSISTORS HAVING SEMICONDUCTOR STRUCTURES INTEGRATED WI...

STACKED MEMORY STRUCTURE WITH DUAL-CHANNEL TRANSISTOR

GATE-TO-GATE ISOLATION FOR STACKED TRANSISTOR ARCHITECTURE VIA SELE...

COMPOSITIONAL ENGINEERING OF SCHOTTKY DIODE

NOVEL METHOD TO FORM SINGLE CRYSTAL MOSFET AND FEFET

NOVEL ESD PROTECTION DECOUPLED FROM DIFFUSION

Integrated Circuits and Methods for Forming Thin Film Crystal Layers

TRANSISTORS INCLUDING TWO-DIMENSIONAL MATERIALS

DAMASCENE INTERCONNECT STRUCTURES WITH LOW RESISTANCE VIAS FOR INTE...

TRANSISTOR CHANNEL PASSIVATION WITH 2D CRYSTALLINE MATERIAL

STACKED FORKSHEET TRANSISTORS

MONOLITHIC MEMORY STACK

INTEGRATED CIRCUITS AND METHODS FOR FORMING INTEGRATED CIRCUITS

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING FIN STACK ISOL...

INTEGRATED CIRCUIT STRUCTURES HAVING LINERLESS SELF-FORMING BARRIERS

TRANSISTOR CHANNEL PASSIVATION WITH 2D CRYSTALLINE MATERIAL

DEVICE WITH AIR-GAPS TO REDUCE COUPLING CAPACITANCE AND PROCESS FOR...

VERTICALLY STACKED MEMORY ELEMENTS WITH AIR GAP

LOCAL INTERCONNECT WITH AIR GAP

TRANSISTORS WITH METAL CHALCOGENIDE CHANNEL MATERIALS

NON-PLANAR TRANSISTORS WITH CHANNEL REGIONS HAVING VARYING WIDTHS

SELECTABLE VIAS FOR BACK END OF LINE INTERCONNECTS