Uwe Hoeckele

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing an imager and imager device
- Patent number 10,854,669
- Issue date Dec 1, 2020
- Infineon Technologies AG
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an imager and imager device
- Patent number 10,692,921
- Issue date Jun 23, 2020
- Infineon Technologies AG
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an imager and imager device
- Patent number 10,411,060
- Issue date Sep 10, 2019
- Infineon Technologies AG
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded system and a method for adhesively bonding a hygroscopic mat...
- Patent number 10,332,814
- Issue date Jun 25, 2019
- Infineon Technologies AG
- Claus Von Waechter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layer and method of making a passivation layer
- Patent number 9,728,480
- Issue date Aug 8, 2017
- Infineon Technologies AG
- Kurt Matoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an imager and imager device
- Patent number 9,659,992
- Issue date May 23, 2017
- Infineon Technologies AG
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor device
- Patent number 9,236,290
- Issue date Jan 12, 2016
- Infineon Technologies AG
- Carsten Ahrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive lines and pads and method of manufacturing thereof
- Patent number 9,006,898
- Issue date Apr 14, 2015
- Infineon Technologies AG
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a device on a substrate
- Patent number 8,999,187
- Issue date Apr 7, 2015
- Infineon Technologies AG
- Sandra Obernhuber
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Chip comprising an integrated circuit, fabrication method and metho...
- Patent number 8,927,419
- Issue date Jan 6, 2015
- Infineon Technologies AG
- Uwe Hoeckele
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor packages and methods of formation thereof
- Patent number 8,866,274
- Issue date Oct 21, 2014
- Infineon Technologies AG
- Hermann Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate via semiconductor components and methods of forma...
- Patent number 8,815,743
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a device on a substrate
- Patent number 8,597,531
- Issue date Dec 3, 2013
- Infineon Technologies AG
- Sandra Obernhuber
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Chip comprising an integrated circuit, fabrication method and metho...
- Patent number 8,598,593
- Issue date Dec 3, 2013
- Infineon Technologies AG
- Uwe Hoeckele
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Conductive lines and pads and method of manufacturing thereof
- Patent number 8,586,472
- Issue date Nov 19, 2013
- Infineon Technologies AG
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate via semiconductor components
- Patent number 8,399,936
- Issue date Mar 19, 2013
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having a semiconductor arrangement
- Patent number 7,834,427
- Issue date Nov 16, 2010
- Infineon Technologies Austria AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate via semiconductor components
- Patent number 7,772,123
- Issue date Aug 10, 2010
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING AN IMAGER AND IMAGER DEVICE
- Publication number 20200321388
- Publication date Oct 8, 2020
- INFINEON TECHNOLOGIES AG
- Dirk MEINHOLD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN IMAGER AND IMAGER DEVICE
- Publication number 20200006418
- Publication date Jan 2, 2020
- INFINEON TECHNOLOGIES AG
- Dirk MEINHOLD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN IMAGER AND IMAGER DEVICE
- Publication number 20170301721
- Publication date Oct 19, 2017
- INFINEON TECHNOLOGIES AG
- Dirk MEINHOLD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SYSTEM AND A METHOD FOR ADHESIVELY BONDING A HYGROSCOPIC MAT...
- Publication number 20160247739
- Publication date Aug 25, 2016
- INFINEON TECHNOLOGIES AG
- Claus Von Waechter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Semiconductor Device
- Publication number 20160086842
- Publication date Mar 24, 2016
- INFINEON TECHNOLOGIES AG
- Carsten Ahrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivation Layer and Method of Making a Passivation Layer
- Publication number 20150235917
- Publication date Aug 20, 2015
- INFINEON TECHNOLOGIES AG
- Kurt Matoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Lines and Pads and Method of Manufacturing Thereof
- Publication number 20150194398
- Publication date Jul 9, 2015
- INFINEON TECHNOLOGIES AG
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Comprising an Integrated Circuit, Fabrication Method and Metho...
- Publication number 20150087145
- Publication date Mar 26, 2015
- INFINEON TECHNOLOGIES AG
- Uwe Hoeckele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing an imager and imager device
- Publication number 20140284663
- Publication date Sep 25, 2014
- INFINEON TECHNOLOGIES AG
- Dirk MEINHOLD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivation Layer and Method of Making a Passivation Layer
- Publication number 20140117511
- Publication date May 1, 2014
- INFINEON TECHNOLOGIES AG
- Kurt Matoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing a Device on a Substrate
- Publication number 20140083973
- Publication date Mar 27, 2014
- INFINEON TECHNOLOGIES AG
- Sandra Obernhuber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Comprising an Integrated Circuit, Fabrication Method and Metho...
- Publication number 20140073132
- Publication date Mar 13, 2014
- Uwe Hoeckele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Lines and Pads and Method of Manufacturing Thereof
- Publication number 20140048940
- Publication date Feb 20, 2014
- INFINEON TECHNOLOGIES AG
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Substrate Via Semiconductor Components And Methods of Forma...
- Publication number 20130267093
- Publication date Oct 10, 2013
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Formation Thereof
- Publication number 20130256857
- Publication date Oct 3, 2013
- INFINEON TECHNOLOGIES AG
- Hermann Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Comprising an Integrated Circuit, Fabrication Method and Metho...
- Publication number 20130015583
- Publication date Jan 17, 2013
- INFINEON TECHNOLOGIES AG
- Uwe Hoeckele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Semiconductor Device
- Publication number 20120289023
- Publication date Nov 15, 2012
- INFINEON TECHNOLOGIES AG
- Carsten Ahrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Lines and Pads and Method of Manufacturing Thereof
- Publication number 20120013011
- Publication date Jan 19, 2012
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing a Device on a Substrate
- Publication number 20100252526
- Publication date Oct 7, 2010
- Sandra Obernhuber
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Through Substrate Via Semiconductor Components
- Publication number 20100230818
- Publication date Sep 16, 2010
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Substrate Via Semiconductor Components
- Publication number 20090302480
- Publication date Dec 10, 2009
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING A SEMICONDUCTOR ARRANGEMENT
- Publication number 20080179669
- Publication date Jul 31, 2008
- Infineon Technologies Austria AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS

Uwe Hoeckele

Person

Patents Grantslast 30 patents

Method of manufacturing an imager and imager device

Method of manufacturing an imager and imager device

Method of manufacturing an imager and imager device

Bonded system and a method for adhesively bonding a hygroscopic mat...

Passivation layer and method of making a passivation layer

Method of manufacturing an imager and imager device

Method for producing a semiconductor device

Conductive lines and pads and method of manufacturing thereof

Method for manufacturing a device on a substrate

Chip comprising an integrated circuit, fabrication method and metho...

Semiconductor packages and methods of formation thereof

Through substrate via semiconductor components and methods of forma...

Method for manufacturing a device on a substrate

Chip comprising an integrated circuit, fabrication method and metho...

Conductive lines and pads and method of manufacturing thereof

Through substrate via semiconductor components

Integrated circuit having a semiconductor arrangement

Through substrate via semiconductor components

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING AN IMAGER AND IMAGER DEVICE

METHOD OF MANUFACTURING AN IMAGER AND IMAGER DEVICE

METHOD OF MANUFACTURING AN IMAGER AND IMAGER DEVICE

BONDED SYSTEM AND A METHOD FOR ADHESIVELY BONDING A HYGROSCOPIC MAT...

Method for Producing a Semiconductor Device

Passivation Layer and Method of Making a Passivation Layer

Conductive Lines and Pads and Method of Manufacturing Thereof

Chip Comprising an Integrated Circuit, Fabrication Method and Metho...

Method of Manufacturing an imager and imager device

Passivation Layer and Method of Making a Passivation Layer

Method for Manufacturing a Device on a Substrate

Chip Comprising an Integrated Circuit, Fabrication Method and Metho...

Conductive Lines and Pads and Method of Manufacturing Thereof

Through Substrate Via Semiconductor Components And Methods of Forma...

Semiconductor Packages and Methods of Formation Thereof

Chip Comprising an Integrated Circuit, Fabrication Method and Metho...

Method for Producing a Semiconductor Device

Conductive Lines and Pads and Method of Manufacturing Thereof

Method for Manufacturing a Device on a Substrate

Through Substrate Via Semiconductor Components

Through Substrate Via Semiconductor Components

INTEGRATED CIRCUIT HAVING A SEMICONDUCTOR ARRANGEMENT