Uwe Seidel

Person

Munich, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Package having an electronic component and an encapsulant encapsula...
- Patent number 12,112,992
- Issue date Oct 8, 2024
- Infineon Technologies AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices related to radio frequency devices
- Patent number 11,948,802
- Issue date Apr 2, 2024
- Infineon Technologies Dresden GmbH & Co. KG
- Hans Taddiken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with semiconductor die having a low ohmic port...
- Patent number 11,605,572
- Issue date Mar 14, 2023
- Infineon Technologies AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices related to radio frequency devices
- Patent number 11,217,453
- Issue date Jan 4, 2022
- Infineon Technologies Dresden GmbH & Co. KG
- Hans Taddiken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for manufacturing the device
- Patent number 10,615,029
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Christoph Kadow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding device
- Patent number 9,659,877
- Issue date May 23, 2017
- Infineon Technologies AG
- Winfried Bakalski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a fuse structure and a method for m...
- Patent number 9,165,828
- Issue date Oct 20, 2015
- Infineon Technologies AG
- Gabriele Bettineschi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for making same
- Patent number 9,159,620
- Issue date Oct 13, 2015
- Infineon Technologies AG
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making conductive interconnects
- Patent number 8,822,329
- Issue date Sep 2, 2014
- Infineon Technologies AG
- Rainer Leuschner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate via semiconductor components and methods of forma...
- Patent number 8,815,743
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate features in semiconductor substrates
- Patent number 8,697,574
- Issue date Apr 15, 2014
- Infineon Technologies AG
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a fuse structure and a method for m...
- Patent number 8,659,118
- Issue date Feb 25, 2014
- Infineon Technologies AG
- Gabriele Bettineschi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding device
- Patent number 8,513,782
- Issue date Aug 20, 2013
- Infineon Technologies AG
- Winfried Bakalski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micromechanical sound transducer having a membrane support with tap...
- Patent number 8,461,655
- Issue date Jun 11, 2013
- Infineon Technologies AG
- Wolfgang Klein
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Through substrate via semiconductor components
- Patent number 8,399,936
- Issue date Mar 19, 2013
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a copper connection between two sides of a sub...
- Patent number 8,227,340
- Issue date Jul 24, 2012
- Infineon Technologies AG
- Uwe Seidel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding device
- Patent number 7,999,358
- Issue date Aug 16, 2011
- Infineon Technologies AG
- Winfried Bakalski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate via semiconductor components
- Patent number 7,772,123
- Issue date Aug 10, 2010
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabrication of a contact structure
- Patent number 7,176,128
- Issue date Feb 13, 2007
- Infineon Technologies AG
- Carsten Ahrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preventing redeposition of etching products onto substra...
- Patent number 6,380,094
- Issue date Apr 30, 2002
- Infineon Technologies AG
- Uwe Seidel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Package Having an Electronic Component and an Encapsulant Encapsula...
- Publication number 20230187298
- Publication date Jun 15, 2023
- INFINEON TECHNOLOGIES AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Devices Related to Radio Frequency Devices
- Publication number 20220115499
- Publication date Apr 14, 2022
- Infineon Technologies Dresden GmbH & Co. KG
- Hans Taddiken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component with Semiconductor Die Having a Low Ohmic Port...
- Publication number 20210335687
- Publication date Oct 28, 2021
- INFINEON TECHNOLOGIES AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Devices Related to Radio Frequency Devices
- Publication number 20210043497
- Publication date Feb 11, 2021
- Infineon Technologies Dresden GmbH & Co. KG
- Hans Taddiken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for Manufacturing the Device
- Publication number 20190043716
- Publication date Feb 7, 2019
- INFINEON TECHNOLOGIES AG
- Christoph Kadow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME
- Publication number 20150017801
- Publication date Jan 15, 2015
- INFINEON TECHNOLOGIES AG
- Gunther MACKH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Comprising a Fuse Structure and a Method for M...
- Publication number 20140127895
- Publication date May 8, 2014
- INFINEON TECHNOLOGIES AG
- Gabriele Bettineschi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDING DEVICE
- Publication number 20130328178
- Publication date Dec 12, 2013
- INFINEON TECHNOLOGIES AG
- Winfried Bakalski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Substrate Via Semiconductor Components And Methods of Forma...
- Publication number 20130267093
- Publication date Oct 10, 2013
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Manufacturing a Semiconductor
- Publication number 20130026601
- Publication date Jan 31, 2013
- INFINEON TECHNOLOGIES AG
- Gabriele Bettineschi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micromechanical Sound Transducer Having a Membrane Support with Tap...
- Publication number 20120248554
- Publication date Oct 4, 2012
- INFINEON TECHNOLOGIES AG
- Wolfgang Klein
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SHIELDING DEVICE
- Publication number 20110260302
- Publication date Oct 27, 2011
- INFINEON TECHNOLOGIES AG
- Winfried Bakalski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure and Method for Making Same
- Publication number 20110073997
- Publication date Mar 31, 2011
- Rainer Leuschner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Substrate Features in Semiconductor Substrates
- Publication number 20110073987
- Publication date Mar 31, 2011
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing an Electrically Conductive Connection
- Publication number 20100279503
- Publication date Nov 4, 2010
- Uwe Seidel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Substrate Via Semiconductor Components
- Publication number 20100230818
- Publication date Sep 16, 2010
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Substrate Via Semiconductor Components
- Publication number 20090302480
- Publication date Dec 10, 2009
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDING DEVICE
- Publication number 20070262422
- Publication date Nov 15, 2007
- Infineon Technologies AG
- Winfried Bakalski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabrication of a contact structure
- Publication number 20050153546
- Publication date Jul 14, 2005
- Carsten Ahrens
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Package having an electronic component and an encapsulant encapsula...

Methods and devices related to radio frequency devices

Electronic component with semiconductor die having a low ohmic port...

Methods and devices related to radio frequency devices

Device and method for manufacturing the device

Shielding device

Semiconductor device comprising a fuse structure and a method for m...

Semiconductor structure and method for making same

Method for making conductive interconnects

Through substrate via semiconductor components and methods of forma...

Through substrate features in semiconductor substrates

Semiconductor device comprising a fuse structure and a method for m...

Shielding device

Micromechanical sound transducer having a membrane support with tap...

Through substrate via semiconductor components

Method for producing a copper connection between two sides of a sub...

Shielding device

Through substrate via semiconductor components

Method for fabrication of a contact structure

Method for preventing redeposition of etching products onto substra...

Patents Applicationslast 30 patents

Package Having an Electronic Component and an Encapsulant Encapsula...

Methods and Devices Related to Radio Frequency Devices

Electronic Component with Semiconductor Die Having a Low Ohmic Port...

Methods and Devices Related to Radio Frequency Devices

Device and Method for Manufacturing the Device

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME

Semiconductor Device Comprising a Fuse Structure and a Method for M...

SHIELDING DEVICE

Through Substrate Via Semiconductor Components And Methods of Forma...

Semiconductor Device and Method for Manufacturing a Semiconductor

Micromechanical Sound Transducer Having a Membrane Support with Tap...

SHIELDING DEVICE

Semiconductor Structure and Method for Making Same

Through Substrate Features in Semiconductor Substrates

Method for Producing an Electrically Conductive Connection

Through Substrate Via Semiconductor Components

Through Substrate Via Semiconductor Components

SHIELDING DEVICE

Method for fabrication of a contact structure