Vaclav Jelinek

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River Edge, NJ, US

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Patents Grantslast 30 patents

Information Patent Grant
Wafer holding assembly and wafer processing apparatus having said a...
- Patent number 6,143,147
- Issue date Nov 7, 2000
- Tokyo Electron Limited
- Vaclav Jelinek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for clamping a substrate
- Patent number 5,925,226
- Issue date Jul 20, 1999
- Tokyo Electron Limited
- Steven Hurwitt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer heating chuck with dual zone backplane heating and segmented...
- Patent number 5,595,241
- Issue date Jan 21, 1997
- Sony Corporation
- Vaclav Jelinek
- H01 - BASIC ELECTRIC ELEMENTS