Vadim Gektin

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Charger having retractable cooling surface
- Patent number 10,418,829
- Issue date Sep 17, 2019
- FutureWei Technologies, Inc.
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid coupling mating apparatus and method
- Patent number 10,292,308
- Issue date May 14, 2019
- FutureWei Technologies, Inc.
- Mo Bai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stationary cooling structure for board/chassis-level conduction coo...
- Patent number 10,117,357
- Issue date Oct 30, 2018
- FutureWei Technologies, Inc.
- Mo Bai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical communication component cooling
- Patent number 9,851,520
- Issue date Dec 26, 2017
- Vadim Gektin
- G02 - OPTICS
Information Patent Grant
Heat spreader with thermally coductive foam core
- Patent number 9,813,082
- Issue date Nov 7, 2017
- FutureWei Technologies, Inc.
- Mo Bai
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Centralized chassis architecture for half-width boards
- Patent number 9,241,421
- Issue date Jan 19, 2016
- FutureWei Technologies, Inc.
- Vadim Gektin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for a back plate for heat sink mounting
- Patent number 9,196,564
- Issue date Nov 24, 2015
- FutureWei Technologies, Inc.
- Vadim Gektin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management in 2.5 D semiconductor packaging
- Patent number 8,884,425
- Issue date Nov 11, 2014
- FutureWei Technologies, Inc.
- Anwar A. Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chassis with adjustable baffle for cooling
- Patent number 8,767,391
- Issue date Jul 1, 2014
- FutureWei Technologies, Inc.
- Youlin Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallic thermal joint for high power density chips
- Patent number 8,368,205
- Issue date Feb 5, 2013
- Oracle America, Inc.
- Seshasayee Ankireddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal and power bus stacked package architecture
- Patent number 8,331,094
- Issue date Dec 11, 2012
- Oracle International Corporation
- Seshasayee Ankireddi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optimized lid attach process for thermal management and multi-surfa...
- Patent number 8,283,204
- Issue date Oct 9, 2012
- Oracle America, Inc.
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon nanotube based interposer
- Patent number 8,097,813
- Issue date Jan 17, 2012
- Oracle America, Inc.
- Vadim Gektin
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Optimized lid attach process for thermal management and multi-surfa...
- Patent number 7,939,364
- Issue date May 10, 2011
- Oracle America, Inc.
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite interconnect
- Patent number 7,791,194
- Issue date Sep 7, 2010
- Oracle America, Inc.
- Vadim Gektin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-lid semiconductor package
- Patent number 7,619,308
- Issue date Nov 17, 2009
- Sun Microsystems, Inc.
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package lid or heat spreader for microprocessor packages
- Patent number 7,301,227
- Issue date Nov 27, 2007
- Sun Microsystems, Inc.
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gasketed field-replaceable active integrated liquid pump heat sink...
- Patent number 7,187,550
- Issue date Mar 6, 2007
- Sun Microsystems, Inc.
- Ali Heydari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal heat spreader
- Patent number 7,007,741
- Issue date Mar 7, 2006
- Sun Microsystems, Inc.
- Bidyut K. Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink with active liquid base
- Patent number 6,945,315
- Issue date Sep 20, 2005
- Sun Microsystems, Inc.
- Vadim Gektin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method and apparatus for force transfer via bare die package
- Patent number 6,836,408
- Issue date Dec 28, 2004
- Sun Microsystems, Inc.
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for enhancing thermal performance of integrat...
- Patent number 6,727,193
- Issue date Apr 27, 2004
- Sun Microsystems, Inc.
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Facilitating heat transfer from an integrated circuit package
- Patent number 6,653,167
- Issue date Nov 25, 2003
- Sun Microsystems, Inc.
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for facilitating alignment of silicon die
- Patent number 6,649,443
- Issue date Nov 18, 2003
- Sun Microsystems, Inc.
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-material heat spreader
- Patent number 6,637,506
- Issue date Oct 28, 2003
- Sun Microsystems, Inc.
- Vadim Gektin
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
CHARGER HAVING RETRACTABLE COOLING SURFACE
- Publication number 20180205245
- Publication date Jul 19, 2018
- FutureWei Technologies, Inc.
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL COMMUNICATION COMPONENT COOLING
- Publication number 20170307837
- Publication date Oct 26, 2017
- FutureWei Technologies, Inc.
- Vadim Gektin
- G02 - OPTICS
Information Patent Application
Heat Spreader with Thermally Coductive Foam Core
- Publication number 20170104500
- Publication date Apr 13, 2017
- FutureWei Technologies, Inc.
- Mo Bai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUID COUPLING MATING APPARATUS AND METHOD
- Publication number 20170030497
- Publication date Feb 2, 2017
- FutureWei Technologies, Inc.
- Mo Bai
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
STATIONARY COOLING STRUCTURE FOR BOARD/CHASSIS-LEVEL CONDUCTION COO...
- Publication number 20170027083
- Publication date Jan 26, 2017
- FutureWei Technologies, Inc.
- Mo Bai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Centralized Chassis Architecture for Half-Width Boards
- Publication number 20150036280
- Publication date Feb 5, 2015
- FutureWei Technologies, Inc.
- Vadim Gektin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT IN 2.5 D SEMICONDUCTOR PACKAGING
- Publication number 20140332948
- Publication date Nov 13, 2014
- FutureWei Technologies, Inc.
- Anwar A. Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for a Back Plate for Heat Sink Mounting
- Publication number 20140262449
- Publication date Sep 18, 2014
- FutureWei Technologies, Inc.
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chassis with Adjustable Baffle for Cooling
- Publication number 20140055951
- Publication date Feb 27, 2014
- FutureWei Technologies, Inc.
- Youlin Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL AND POWER BUS STACKED PACKAGE ARCHITECTURE
- Publication number 20120188708
- Publication date Jul 26, 2012
- Oracle International Corporation
- SESHASAYEE ANKIREDDI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METALLIC THERMAL JOINT FOR HIGH POWER DENSITY CHIPS
- Publication number 20120153453
- Publication date Jun 21, 2012
- ORACLE AMERICA, INC.
- Seshasayee Ankireddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZED LID ATTACH PROCESS FOR THERMAL MANAGEMENT AND MULTI-SURFA...
- Publication number 20110177656
- Publication date Jul 21, 2011
- Oracle International Corporation
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOTUBE BASED INTERPOSER
- Publication number 20100243298
- Publication date Sep 30, 2010
- SUN MICROSYSTEMS, INC.
- Vadim Gektin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTIMIZED LID ATTACH PROCESS FOR THERMAL MANAGEMENT AND MULTI-SURFA...
- Publication number 20090286359
- Publication date Nov 19, 2009
- SUN MICROSYSTEMS, INC.
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LID SEMICONDUCTOR PACKAGE
- Publication number 20090273077
- Publication date Nov 5, 2009
- SUN MICROSYSTEMS, INC.
- Vadim GEKTIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE INTERCONNECT
- Publication number 20090256255
- Publication date Oct 15, 2009
- SUN MICROSYSTEMS, INC.
- Vadim Gektin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conformal heat spreader
- Publication number 20040074630
- Publication date Apr 22, 2004
- Bidyut K. Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for dispensing interface materials
- Publication number 20040065410
- Publication date Apr 8, 2004
- Sun Microsystems, Inc.
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for force transfer via bare die package
- Publication number 20040057213
- Publication date Mar 25, 2004
- Sun Microsystems, Inc.
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat spreader with surface cavity
- Publication number 20040042178
- Publication date Mar 4, 2004
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and methods for enhancing thermal performance of integrat...
- Publication number 20030171006
- Publication date Sep 11, 2003
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-MATERIAL HEAT SPREADER
- Publication number 20030168203
- Publication date Sep 11, 2003
- Vadim Gektin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Alignment of silicon die
- Publication number 20030057575
- Publication date Mar 27, 2003
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Facilitating heat transfer from an integrated circuit package
- Publication number 20030047803
- Publication date Mar 13, 2003
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to place a thermal interface when manufacturing an integrate...
- Publication number 20020177306
- Publication date Nov 28, 2002
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS

Vadim Gektin

Person

Patents Grantslast 30 patents

Charger having retractable cooling surface

Fluid coupling mating apparatus and method

Stationary cooling structure for board/chassis-level conduction coo...

Optical communication component cooling

Heat spreader with thermally coductive foam core

Centralized chassis architecture for half-width boards

Apparatus and method for a back plate for heat sink mounting

Thermal management in 2.5 D semiconductor packaging

Chassis with adjustable baffle for cooling

Metallic thermal joint for high power density chips

Thermal and power bus stacked package architecture

Optimized lid attach process for thermal management and multi-surfa...

Carbon nanotube based interposer

Optimized lid attach process for thermal management and multi-surfa...

Composite interconnect

Multi-lid semiconductor package

Package lid or heat spreader for microprocessor packages

Gasketed field-replaceable active integrated liquid pump heat sink...

Conformal heat spreader

Heatsink with active liquid base

Method and apparatus for force transfer via bare die package

Apparatus and methods for enhancing thermal performance of integrat...

Facilitating heat transfer from an integrated circuit package

System for facilitating alignment of silicon die

Multi-material heat spreader

Patents Applicationslast 30 patents

CHARGER HAVING RETRACTABLE COOLING SURFACE

OPTICAL COMMUNICATION COMPONENT COOLING

Heat Spreader with Thermally Coductive Foam Core

FLUID COUPLING MATING APPARATUS AND METHOD

STATIONARY COOLING STRUCTURE FOR BOARD/CHASSIS-LEVEL CONDUCTION COO...

Centralized Chassis Architecture for Half-Width Boards

THERMAL MANAGEMENT IN 2.5 D SEMICONDUCTOR PACKAGING

Apparatus and Method for a Back Plate for Heat Sink Mounting

Chassis with Adjustable Baffle for Cooling

THERMAL AND POWER BUS STACKED PACKAGE ARCHITECTURE

METALLIC THERMAL JOINT FOR HIGH POWER DENSITY CHIPS

OPTIMIZED LID ATTACH PROCESS FOR THERMAL MANAGEMENT AND MULTI-SURFA...

CARBON NANOTUBE BASED INTERPOSER

OPTIMIZED LID ATTACH PROCESS FOR THERMAL MANAGEMENT AND MULTI-SURFA...

MULTI-LID SEMICONDUCTOR PACKAGE

COMPOSITE INTERCONNECT

Conformal heat spreader

Method and apparatus for dispensing interface materials

Method and apparatus for force transfer via bare die package

Heat spreader with surface cavity

Apparatus and methods for enhancing thermal performance of integrat...

MULTI-MATERIAL HEAT SPREADER

Alignment of silicon die

Facilitating heat transfer from an integrated circuit package

Method to place a thermal interface when manufacturing an integrate...