Vadim Heyfitch

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Los Gatos, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
High density routing for heterogeneous package integration
- Patent number 11,282,776
- Issue date Mar 22, 2022
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test structures for validating package fabrication process
- Patent number 11,127,643
- Issue date Sep 21, 2021
- Xilinx, Inc.
- Vadim Heyfitch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive peaking circuit comprising a step-down impedance transformer
- Patent number 9,066,391
- Issue date Jun 23, 2015
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Vadim Heyfitch
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
Power Management of a Power Regulator in a Processor During High Cu...
- Publication number 20240248524
- Publication date Jul 25, 2024
- Groq, Inc.
- Santosh Raghavan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Preemptive Processor Power Supply Regulator Feedback Modulation to...
- Publication number 20240176406
- Publication date May 30, 2024
- Groq, Inc.
- Vadim Heyfitch
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH DENSITY ROUTING FOR HETEROGENEOUS PACKAGE INTEGRATION
- Publication number 20190259695
- Publication date Aug 22, 2019
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- G01 - MEASURING TESTING
Information Patent Application
PASSIVE PEAKING CIRCUIT COMPRISING A STEP-DOWN IMPEDANCE TRANSFORMER
- Publication number 20150156832
- Publication date Jun 4, 2015
- Avago Technologies General IP (Singapore) PTE. LTD.
- Vadim Heyfitch
- H04 - ELECTRIC COMMUNICATION TECHNIQUE