Vadim Sherman

Follow

Person

Scottsdale, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package substrate dynamic pressure structure
- Patent number 9,111,929
- Issue date Aug 18, 2015
- Intel Corporation
- Stewart M. Ongchin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Package substrate dynamic pressure structure
- Patent number 8,617,921
- Issue date Dec 31, 2013
- Intel Corporation
- Stewart M. Ongchin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Package substrate dynamic pressure structure
- Patent number 8,143,721
- Issue date Mar 27, 2012
- Intel Corporation
- Stewart M. Ongchin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Apparatus and system for an IC substrate, socket, and assembly
- Patent number 7,518,222
- Issue date Apr 14, 2009
- Intel Corporation
- Xiaoqing Ma
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE SUBSTRATE DYNAMIC PRESSURE STRUCTURE
- Publication number 20140113409
- Publication date Apr 24, 2014
- Stewart M. ONGCHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE DYNAMIC PRESSURE STRUCTURE
- Publication number 20120174385
- Publication date Jul 12, 2012
- Stewart ONGCHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and system for an IC substrate, socket, and assembly
- Publication number 20070228531
- Publication date Oct 4, 2007
- Xiaoqing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In-package connection between integrated circuit dies via flex tape
- Publication number 20060289986
- Publication date Dec 28, 2006
- Vadim Sherman
- H01 - BASIC ELECTRIC ELEMENTS