Val Dubin

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Portland, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Copper die bumps with electromigration cap and plated solder
- Patent number 7,919,859
- Issue date Apr 5, 2011
- Intel Corporation
- Ting Zhong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Copper die bumps with electromigration cap and plated solder
- Publication number 20080230896
- Publication date Sep 25, 2008
- Ting Zhong
- H01 - BASIC ELECTRIC ELEMENTS