Valerie Oberson

Person

rue de Granby, CA

People

Patents Grantslast 30 patents

Information Patent Grant
Direct bonded heterogeneous integration packaging structures
- Patent number 11,177,217
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat laminate, symmetrical test structures and method of use to gau...
- Patent number 10,699,972
- Issue date Jun 30, 2020
- International Business Machines Corporation
- William E. Bernier
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Direct bonded heterogeneous integration packaging structures
- Patent number 10,580,738
- Issue date Mar 3, 2020
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat laminate, symmetrical test structures and method of use to gau...
- Patent number 9,899,279
- Issue date Feb 20, 2018
- International Business Machines Corporation
- William E. Bernier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flux composition and techniques for use thereof
- Patent number 9,815,149
- Issue date Nov 14, 2017
- International Business Machines Corporation
- Kang-Wook Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux composition and techniques for use thereof
- Patent number 9,808,874
- Issue date Nov 7, 2017
- International Business Machines Corporation
- Kang-Wook Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux composition and techniques for use thereof
- Patent number 9,579,738
- Issue date Feb 28, 2017
- International Business Machines Corporation
- Kang-Wook Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flat laminate, symmetrical test structures and method of use to gau...
- Patent number 8,957,531
- Issue date Feb 17, 2015
- International Business Machines Corporation
- William E. Bernier
- G01 - MEASURING TESTING
Information Patent Grant
Interconnections for flip-chip using lead-free solders and having i...
- Patent number 8,314,500
- Issue date Nov 20, 2012
- Ultratech, Inc.
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Creation of lead-free solder joint with intermetallics
- Patent number 8,268,716
- Issue date Sep 18, 2012
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimization of metallurgical properties of a solder joint
- Patent number 8,197,612
- Issue date Jun 12, 2012
- International Business Machines Corporation
- James A Busby
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure of UBM and solder bumps and methods of fabrication
- Patent number 8,003,512
- Issue date Aug 23, 2011
- International Business Machines Corporation
- Luc L. Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection for flip-chip using lead-free solders and having im...
- Patent number 7,932,169
- Issue date Apr 26, 2011
- International Business Machines Corporation
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flux composition and process for use thereof
- Patent number 7,780,801
- Issue date Aug 24, 2010
- International Business Machines Corporation
- Eric Duchesne
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux composition and techniques for use thereof
- Patent number 7,740,713
- Issue date Jun 22, 2010
- International Business Machines Corporation
- Eric Duchesne
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluxless solder transfer and reflow process
- Patent number 7,332,424
- Issue date Feb 19, 2008
- International Business Machines Corporation
- Luc Bélanger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HETEROGENEOUS SOLDER BUMP STRUCTURE
- Publication number 20240113060
- Publication date Apr 4, 2024
- Societe de commercialisation des produits de la recherche appliquee SOCPRA Sc...
- Abderrahim EL AMRANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED HETEROGENEOUS INTEGRATION PACKAGING STRUCTURES
- Publication number 20200144187
- Publication date May 7, 2020
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED HETEROGENEOUS INTEGRATION PACKAGING STRUCTURES
- Publication number 20190295952
- Publication date Sep 26, 2019
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT LAMINATE, SYMMETRICAL TEST STRUCTURES AND METHOD OF USE TO GAU...
- Publication number 20180082912
- Publication date Mar 22, 2018
- International Business Machines Corporation
- William E. Bernier
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Flux Composition and Techniques for Use Thereof
- Publication number 20150231721
- Publication date Aug 20, 2015
- International Business Machines Corporation
- Kang-Wook Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLAT LAMINATE, SYMMETRICAL TEST STRUCTURES AND METHOD OF USE TO GAU...
- Publication number 20150036716
- Publication date Feb 5, 2015
- International Business Machines Corporation
- William E. Bernier
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Flat Laminate, Symmetrical Test Structures and Method of Use To Gau...
- Publication number 20130098176
- Publication date Apr 25, 2013
- International Business Machines Corporation
- William E. Bernier
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Flux Composition and Techniques for Use Thereof
- Publication number 20130001279
- Publication date Jan 3, 2013
- International Business Machines Corporation
- Kang-Wook Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flux Composition and Techniques for Use Thereof
- Publication number 20120217290
- Publication date Aug 30, 2012
- International Business Machines Corporation
- Kang-Wook Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flux Composition and Techniques for Use Thereof
- Publication number 20120217289
- Publication date Aug 30, 2012
- International Business Machines Corporation
- Kang-Wook Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CREATION OF LEAD-FREE SOLDER JOINT WITH INTERMETALLICS
- Publication number 20120083113
- Publication date Apr 5, 2012
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL STRUCTURE OF UBM AND SOLDER BUMPS AND METHODS OF FABRICATION
- Publication number 20100193949
- Publication date Aug 5, 2010
- International Business Machines Corporation
- Luc L. Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
New Flux Composition and Process For Use Thereof
- Publication number 20100175790
- Publication date Jul 15, 2010
- International Business Machines Corporation
- Eric Duchesne
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnection for flip-chip using lead-free solders and having im...
- Publication number 20100062597
- Publication date Mar 11, 2010
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZATION OF METALLURGICAL PROPERTIES OF A SOLDER JOINT
- Publication number 20090266447
- Publication date Oct 29, 2009
- International Business Machines Corporation
- JAMES A. BUSBY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Forming a Solder Mold with Venting Channels and Method f...
- Publication number 20090039142
- Publication date Feb 12, 2009
- Raschid Jose Bezama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Mold With Venting Channels
- Publication number 20090039140
- Publication date Feb 12, 2009
- Raschid Jose Bezama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING I...
- Publication number 20080157395
- Publication date Jul 3, 2008
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
New flux composition and process for use thereof
- Publication number 20080124568
- Publication date May 29, 2008
- Eric Duchesne
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fluxless solder transfer and reflow process
- Publication number 20060035454
- Publication date Feb 16, 2006
- IBM Corporation
- Luc Belanger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Injection molded continuously solidified solder method and apparatus
- Publication number 20050263571
- Publication date Dec 1, 2005
- Luc Belanger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flux composition and techniques for use thereof
- Publication number 20050241731
- Publication date Nov 3, 2005
- International Business Machines Corporation
- Eric Duchesne
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Valerie Oberson

Person

Patents Grantslast 30 patents

Direct bonded heterogeneous integration packaging structures

Flat laminate, symmetrical test structures and method of use to gau...

Direct bonded heterogeneous integration packaging structures

Flat laminate, symmetrical test structures and method of use to gau...

Flux composition and techniques for use thereof

Flux composition and techniques for use thereof

Flux composition and techniques for use thereof

Flat laminate, symmetrical test structures and method of use to gau...

Interconnections for flip-chip using lead-free solders and having i...

Creation of lead-free solder joint with intermetallics

Optimization of metallurgical properties of a solder joint

Structure of UBM and solder bumps and methods of fabrication

Interconnection for flip-chip using lead-free solders and having im...

Flux composition and process for use thereof

Flux composition and techniques for use thereof

Fluxless solder transfer and reflow process

Patents Applicationslast 30 patents

HETEROGENEOUS SOLDER BUMP STRUCTURE

DIRECT BONDED HETEROGENEOUS INTEGRATION PACKAGING STRUCTURES

DIRECT BONDED HETEROGENEOUS INTEGRATION PACKAGING STRUCTURES

FLAT LAMINATE, SYMMETRICAL TEST STRUCTURES AND METHOD OF USE TO GAU...

Flux Composition and Techniques for Use Thereof

FLAT LAMINATE, SYMMETRICAL TEST STRUCTURES AND METHOD OF USE TO GAU...

Flat Laminate, Symmetrical Test Structures and Method of Use To Gau...

Flux Composition and Techniques for Use Thereof

Flux Composition and Techniques for Use Thereof

Flux Composition and Techniques for Use Thereof

CREATION OF LEAD-FREE SOLDER JOINT WITH INTERMETALLICS

NOVEL STRUCTURE OF UBM AND SOLDER BUMPS AND METHODS OF FABRICATION

New Flux Composition and Process For Use Thereof

Interconnection for flip-chip using lead-free solders and having im...

OPTIMIZATION OF METALLURGICAL PROPERTIES OF A SOLDER JOINT

Method for Forming a Solder Mold with Venting Channels and Method f...

Solder Mold With Venting Channels

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING I...

New flux composition and process for use thereof

Fluxless solder transfer and reflow process

Injection molded continuously solidified solder method and apparatus

Flux composition and techniques for use thereof