Valery Ouvarov-Bancalero

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Scottsdale, AZ, US

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Patents Applicationslast 30 patents

Information Patent Application
TECHNOLOGIES FOR LIQUID METAL MIXTURES FOR ELECTRICAL INTERCONNECTS
- Publication number 20230317533
- Publication date Oct 5, 2023
- Intel Corporation
- Gregorio Roberto Murtagian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPING FOR LIQUID METAL SOCKET INTERCONNECTS
- Publication number 20230299024
- Publication date Sep 21, 2023
- Intel Corporation
- Jiaqi Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE Z-DISAGGREGATION WITH LIQUID METAL INTERCONNECTS
- Publication number 20220399263
- Publication date Dec 15, 2022
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE PACKAGE STIFFENERS OF METAL ALLOYS HAVING EX...
- Publication number 20220285288
- Publication date Sep 8, 2022
- Intel Corporation
- Valery Ouvarov-Bancalero
- H01 - BASIC ELECTRIC ELEMENTS