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Vall F. McLean
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Poughkeepsie, NY, US
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Patent Application
METHOD FOR IMPROVED COPPER LAYER ETCHING OF WAFERS WITH C4 CONNECTI...
Publication number
20080119056
Publication date
May 22, 2008
International Business Machines Corporation
Carla A. Bailey
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...