Vandan Tanna

Person

Lake St. Louis, MO, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of processing a cleaved semiconductor wafer
- Patent number 12,270,768
- Issue date Apr 8, 2025
- GlobalWafers Co., Ltd.
- Benjamin Michael Meyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cleaved semiconductor wafer imaging system
- Patent number 12,019,031
- Issue date Jun 25, 2024
- GlobalWafers Co., Ltd.
- Benjamin Michael Meyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cleaved semiconductor wafer camera system
- Patent number 11,921,054
- Issue date Mar 5, 2024
- GlobalWafers Co., Ltd.
- Benjamin Michael Meyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor substrate polishing methods
- Patent number 11,367,649
- Issue date Jun 21, 2022
- GlobalWafers Co., Ltd.
- Hui Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polishing slurries for polishing semiconductor wafers
- Patent number 10,811,307
- Issue date Oct 20, 2020
- GlobalWafers Co., Ltd.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and system for controlling a surface profile of a wafer
- Patent number 10,654,193
- Issue date May 19, 2020
- GlobalWafers Co., Ltd.
- Peter D. Albrecht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and system for controlling a surface profile of a wafer
- Patent number 10,315,337
- Issue date Jun 11, 2019
- GlobalWafers Co. Ltd.
- Peter D. Albrecht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor substrate polishing methods and slurries and methods...
- Patent number 10,128,146
- Issue date Nov 13, 2018
- GlobalWafers Co., Ltd.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR BOND TREATING AND CLEAVING OF SILICON WAFERS
- Publication number 20250157847
- Publication date May 15, 2025
- GLOBALWAFERS CO., LTD.
- Peter Albrecht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEAVED SEMICONDUCTOR WAFER IMAGING SYSTEM
- Publication number 20220084857
- Publication date Mar 17, 2022
- GLOBALWAFERS CO., LTD.
- Benjamin Michael Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEAVED SEMICONDUCTOR WAFER CAMERA SYSTEM
- Publication number 20220082510
- Publication date Mar 17, 2022
- GLOBALWAFERS CO., LTD.
- Benjamin Michael Meyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF PROCESSING A CLEAVED SEMICONDUCTOR WAFER
- Publication number 20220084892
- Publication date Mar 17, 2022
- GLOBALWAFERS CO., LTD.
- Benjamin Michael Meyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR SUBSTRATE POLISHING METHODS
- Publication number 20210013092
- Publication date Jan 14, 2021
- GLOBALWAFERS CO., LTD.
- Hui Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHODS AND SYSTEM FOR CONTROLLING A SURFACE PROFILE OF A WAFER
- Publication number 20190270222
- Publication date Sep 5, 2019
- GLOBALWAFERS CO., LTD.
- Peter D. Albrecht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Polishing Slurries for Polishing Semiconductor Wafers
- Publication number 20190035675
- Publication date Jan 31, 2019
- Global Wafers Co., Ltd
- Hui Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHODS AND SYSTEM FOR CONTROLLING A SURFACE PROFILE OF A WAFER
- Publication number 20180056545
- Publication date Mar 1, 2018
- SunEdison Semiconductor Limited (UEN201334164H)
- Peter D. Albrecht
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SEMICONDUCTOR SUBSTRATE POLISHING METHODS AND SLURRIES AND METHODS...
- Publication number 20170256439
- Publication date Sep 7, 2017
- SunEdison Semiconductor Limited (UEN201334164H)
- Hui Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR SUBSTRATE POLISHING METHODS AND SLURRIES AND METHODS...
- Publication number 20170053826
- Publication date Feb 23, 2017
- SunEdison Semiconductor Limited (UEN201334164H)
- Hui Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER CLEANING APPARATUS AND METHODS
- Publication number 20140150826
- Publication date Jun 5, 2014
- Peter D. Albrecht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems For Processing Abrasive Slurry
- Publication number 20130118962
- Publication date May 16, 2013
- MEMC Electronic Materials, Inc.
- Henry F. Erk
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Methods For Processing Abrasive Slurry
- Publication number 20130118091
- Publication date May 16, 2013
- MEMC Electronic Materials, Inc.
- Henry F. Erk
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Wafer Transport Cart
- Publication number 20130121802
- Publication date May 16, 2013
- MEMC Electronic Materials, Inc.
- Peter D. Albrecht
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Application
Method and System for Processing Abrasive Slurry
- Publication number 20110017230
- Publication date Jan 27, 2011
- MEMC Electronic Materials, Inc.
- Henry F. Erk
- B28 - WORKING CEMENT, CLAY, OR STONE

Vandan Tanna

Person

Patents Grantslast 30 patents

Method of processing a cleaved semiconductor wafer

Cleaved semiconductor wafer imaging system

Cleaved semiconductor wafer camera system

Semiconductor substrate polishing methods

Polishing slurries for polishing semiconductor wafers

Methods and system for controlling a surface profile of a wafer

Methods and system for controlling a surface profile of a wafer

Semiconductor substrate polishing methods and slurries and methods...

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR BOND TREATING AND CLEAVING OF SILICON WAFERS

CLEAVED SEMICONDUCTOR WAFER IMAGING SYSTEM

CLEAVED SEMICONDUCTOR WAFER CAMERA SYSTEM

METHOD OF PROCESSING A CLEAVED SEMICONDUCTOR WAFER

SEMICONDUCTOR SUBSTRATE POLISHING METHODS

METHODS AND SYSTEM FOR CONTROLLING A SURFACE PROFILE OF A WAFER

Polishing Slurries for Polishing Semiconductor Wafers

METHODS AND SYSTEM FOR CONTROLLING A SURFACE PROFILE OF A WAFER

SEMICONDUCTOR SUBSTRATE POLISHING METHODS AND SLURRIES AND METHODS...

SEMICONDUCTOR SUBSTRATE POLISHING METHODS AND SLURRIES AND METHODS...

WAFER CLEANING APPARATUS AND METHODS

Systems For Processing Abrasive Slurry

Methods For Processing Abrasive Slurry

Wafer Transport Cart

Method and System for Processing Abrasive Slurry