VANESSA FAUNE

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Process kit geometry for particle reduction in PVD processes
- Patent number 11,935,732
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Adolph M. Allen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for particle removal from wafers through plasma modification...
- Patent number 11,932,934
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Halbert Chong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for particle removal from wafers through plasma modification...
- Patent number 11,473,189
- Issue date Oct 18, 2022
- Applied Materials, Inc.
- Halbert Chong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Physical vapor deposition (PVD) chamber with in situ chamber cleani...
- Patent number 11,289,312
- Issue date Mar 29, 2022
- Applied Materials, Inc.
- Adolph M. Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetron having enhanced target cooling configuration
- Patent number 11,024,490
- Issue date Jun 1, 2021
- Applied Materials, Inc.
- Vanessa Faune
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PARTICLE REMOVAL FROM WAFERS THROUGH PLASMA MODIFICATION...
- Publication number 20230002885
- Publication date Jan 5, 2023
- Applied Materials, Inc.
- Halbert Chong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PHYSICAL VAPOR DEPOSITION (PVD) CHAMBER WITH IN SITU CHAMBER CLEANI...
- Publication number 20200395198
- Publication date Dec 17, 2020
- Applied Materials, Inc.
- ADOLPH M. ALLEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method For Particle Removal From Wafers Through Plasma Modification...
- Publication number 20200255938
- Publication date Aug 13, 2020
- Applied Materials, Inc.
- Halbert Chong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESS KIT GEOMETRY FOR PARTICLE REDUCTION IN PVD PROCESSES
- Publication number 20190237311
- Publication date Aug 1, 2019
- Applied Materials, Inc.
- ADOLPH M. ALLEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MAGNETRON HAVING ENHANCED TARGET COOLING CONFIGURATION
- Publication number 20190180992
- Publication date Jun 13, 2019
- Applied Materials, Inc.
- VANESSA FAUNE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PULSED DC SOURCE FOR HIGH POWER IMPULSE MAGNETRON SPUTTERING PHYSIC...
- Publication number 20190127842
- Publication date May 2, 2019
- Viachslav BABAYAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BIASED COVER RING FOR A SUBSTRATE PROCESSING SYSTEM
- Publication number 20180151325
- Publication date May 31, 2018
- ADOLPH MILLER ALLEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
POWER DELIVERY FOR HIGH POWER IMPULSE MAGNETRON SPUTTERING (HiPIMS)
- Publication number 20180108519
- Publication date Apr 19, 2018
- Applied Materials, Inc.
- VIACHSLAV BABAYAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

VANESSA FAUNE

Person

Patents Grantslast 30 patents

Process kit geometry for particle reduction in PVD processes

Method for particle removal from wafers through plasma modification...

Method for particle removal from wafers through plasma modification...

Physical vapor deposition (PVD) chamber with in situ chamber cleani...

Magnetron having enhanced target cooling configuration

Patents Applicationslast 30 patents

METHOD FOR PARTICLE REMOVAL FROM WAFERS THROUGH PLASMA MODIFICATION...

PHYSICAL VAPOR DEPOSITION (PVD) CHAMBER WITH IN SITU CHAMBER CLEANI...

Method For Particle Removal From Wafers Through Plasma Modification...

PROCESS KIT GEOMETRY FOR PARTICLE REDUCTION IN PVD PROCESSES

MAGNETRON HAVING ENHANCED TARGET COOLING CONFIGURATION

PULSED DC SOURCE FOR HIGH POWER IMPULSE MAGNETRON SPUTTERING PHYSIC...

BIASED COVER RING FOR A SUBSTRATE PROCESSING SYSTEM

POWER DELIVERY FOR HIGH POWER IMPULSE MAGNETRON SPUTTERING (HiPIMS)