Vanessa Wyn Jean Tan

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Kuala Lumpur, MY

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Patents Grantslast 30 patents

Information Patent Grant
Substrate with reservoir for die attach adhesive
- Patent number 10,325,826
- Issue date Jun 18, 2019
- NXP USA, INC.
- Ly Hoon Khoo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH STRESS RELIEF FEATURE AND METHOD THEREFOR
- Publication number 20240038683
- Publication date Feb 1, 2024
- NXP B.V.
- Tzu Ya Fang
- H01 - BASIC ELECTRIC ELEMENTS