Vassoudevane Lebonheur

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Mold compound cap in a flip chip multi-matrix array package and pro...
- Patent number 7,514,300
- Issue date Apr 7, 2009
- Intel Corporation
- Vassoudevane Lebonheur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vibratable die attachment tool
- Patent number 7,147,735
- Issue date Dec 12, 2006
- Intel Corporation
- Terrence C. Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package and method of manufacturing same
- Patent number 6,975,025
- Issue date Dec 13, 2005
- Intel Corporation
- Vassoudevane LeBonheur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a microelectronic assembly
- Patent number 6,908,789
- Issue date Jun 21, 2005
- Intel Corporation
- Vassoudevane Lebonheur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treatment for microelectronic device substrate
- Patent number 6,794,225
- Issue date Sep 21, 2004
- Intel Corporation
- Rahul Manepalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal performance in flip chip/integral heat spreader packages us...
- Patent number 6,617,683
- Issue date Sep 9, 2003
- Intel Corporation
- Vassoudevane Lebonheur
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Mold compound cap in a flip chip multi-matrix array package and pro...
- Publication number 20080032459
- Publication date Feb 7, 2008
- Vassoudevane Lebonheur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
No-flow underfill materials for flip chips
- Publication number 20060097403
- Publication date May 11, 2006
- Vassoudevane Lebonheur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vibratable die attachment tool
- Publication number 20060016541
- Publication date Jan 26, 2006
- Terrence C. Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A MICROELECTRONIC ASSEMBLY
- Publication number 20050130343
- Publication date Jun 16, 2005
- Vassoudevane Lebonheur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device with reduced entrapment of material between die a...
- Publication number 20050104180
- Publication date May 19, 2005
- Vassoudevane Lebonheur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mold compound cap in a flip chip multi-matrix array package and pro...
- Publication number 20040262776
- Publication date Dec 30, 2004
- Intel Corporation
- Vassoudevane Lebonheur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface treatment for microelectronic device substrate
- Publication number 20040121512
- Publication date Jun 24, 2004
- Rahul Manepalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill materials dispensed in a flip chip package by way of a th...
- Publication number 20030113952
- Publication date Jun 19, 2003
- Mahesh Sambasivam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip package and method of manufacturing same
- Publication number 20030104652
- Publication date Jun 5, 2003
- Vassoudevane LeBonheur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of improving thermal performance in flip chip/integral heat...
- Publication number 20030067069
- Publication date Apr 10, 2003
- Vassoudevane Lebonheur
- H01 - BASIC ELECTRIC ELEMENTS

Vassoudevane Lebonheur

Person

Patents Grantslast 30 patents

Mold compound cap in a flip chip multi-matrix array package and pro...

Vibratable die attachment tool

Semiconductor chip package and method of manufacturing same

Method of making a microelectronic assembly

Surface treatment for microelectronic device substrate

Thermal performance in flip chip/integral heat spreader packages us...

Patents Applicationslast 30 patents

Mold compound cap in a flip chip multi-matrix array package and pro...

No-flow underfill materials for flip chips

Vibratable die attachment tool

METHOD OF MAKING A MICROELECTRONIC ASSEMBLY

Electronic device with reduced entrapment of material between die a...

Mold compound cap in a flip chip multi-matrix array package and pro...

Surface treatment for microelectronic device substrate

Underfill materials dispensed in a flip chip package by way of a th...

Semiconductor chip package and method of manufacturing same

Method of improving thermal performance in flip chip/integral heat...