Vasudeva Atluri

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Scottsdale, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods for preparing semiconductor substrates and interfacial oxid...
- Patent number 7,851,365
- Issue date Dec 14, 2010
- Arizona Board of Regents, a coporate body organized under Arizona Law, Acting...
- Nicole Herbots
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
C4 joint reliability
- Patent number 7,656,035
- Issue date Feb 2, 2010
- Intel Corporation
- Sairam Agraharam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
C4 joint reliability
- Patent number 7,517,787
- Issue date Apr 14, 2009
- Intel Corporation
- Sairam Agraharam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with reduced stress on die and associat...
- Patent number 7,465,651
- Issue date Dec 16, 2008
- Intel Corporation
- Sairam Agraharam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit packages with reduced stress on die and associat...
- Patent number 6,989,586
- Issue date Jan 24, 2006
- Intel Corporation
- Sairam Agraharam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Long range ordered semiconductor interface phase and oxides
- Patent number 6,613,677
- Issue date Sep 2, 2003
- Arizona Board of Regents
- Nicole Herbots
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
C4 JOINT RELIABILITY
- Publication number 20090115057
- Publication date May 7, 2009
- Sairam Agraharam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
C4 joint reliability
- Publication number 20060214292
- Publication date Sep 28, 2006
- Sairam Agraharam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit packages with reduced stress on die and associat...
- Publication number 20050266613
- Publication date Dec 1, 2005
- Intel Corporation
- Sairam Agraharam
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated circuit package with reduced stress on die and associate...
- Publication number 20040188813
- Publication date Sep 30, 2004
- Intel Corporation
- Sairam Agraharam
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...