Veera M. Gunturu

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Austin, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of bond pad protection during wafer processing
- Patent number 9,443,782
- Issue date Sep 13, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Robert F. Steimle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a capped micro-electro-mechanical system (MEMS)...
- Patent number 8,039,312
- Issue date Oct 18, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Veera M. Gunturu
- B81 - MICRO-STRUCTURAL TECHNOLOGY