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Vemmond Jeng Hung NG

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  • Senawang, MY
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND RELATED METHODS
    • Publication number 20240072009
    • Publication date Feb 29, 2024
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULE PACKAGE BASEPLATE WITH STEP RECESS DESIGN
    • Publication number 20230369176
    • Publication date Nov 16, 2023
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Yushuang YAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED POWER TERMINALS IN A POWER ELECTRONICS MODULE
    • Publication number 20230180410
    • Publication date Jun 8, 2023
    • Semiconductor Components Industries, LLC
    • Vemmond Jeng Hung NG
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    POWER MODULE
    • Publication number 20230027138
    • Publication date Jan 26, 2023
    • Semiconductor Components Industries, LLC
    • Yushuang YAO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    POWER MODULE PACKAGE BASEPLATE WITH STEP RECESS DESIGN
    • Publication number 20220157696
    • Publication date May 19, 2022
    • Semiconductor Components Industries, LLC
    • Yushuang YAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULE PACKAGE CASING WITH PROTRUSION SUPPORTS
    • Publication number 20210343620
    • Publication date Nov 4, 2021
    • Semiconductor Components Industries, LLC
    • Yushuang YAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Package and Related Methods
    • Publication number 20200286865
    • Publication date Sep 10, 2020
    • Semiconductor Components Industries, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS