Vempati Srinivasa RAO

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,018,080
- Issue date May 25, 2021
- Agency for Science, Technology and Research
- Roshan Weerasekera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connection structure, semiconductor package and method o...
- Patent number 10,755,993
- Issue date Aug 25, 2020
- Agency for Science, Technology and Research
- David Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL CONNECTION STRUCTURE, SEMICONDUCTOR PACKAGE AND METHOD O...
- Publication number 20190080974
- Publication date Mar 14, 2019
- Agency for Science, Technology and Research
- David HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20190043792
- Publication date Feb 7, 2019
- Agency for Science, Technology and Research
- Roshan WEERASEKERA
- H01 - BASIC ELECTRIC ELEMENTS