Venkat Iyer

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Physical layer to link layer interface and related systems, methods...
- Patent number 12,137,156
- Issue date Nov 5, 2024
- Microchip Technology Incorporated
- Venkat Iyer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Changing a master node in a wired local area network and related sy...
- Patent number 11,876,616
- Issue date Jan 16, 2024
- Microchip Technology Incorporated
- Michael Rentschler
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Ethernet interface and related systems methods and devices
- Patent number 11,171,732
- Issue date Nov 9, 2021
- Microchip Technology Incorporated
- Venkat Iyer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
PHYSICAL LAYER TO LINK LAYER INTERFACE AND RELATED SYSTEMS, METHODS...
- Publication number 20220416992
- Publication date Dec 29, 2022
- Microschip Technology Incorporated
- Venkat Iyer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ETHERNET INTERFACE AND RELATED SYSTEMS, METHODS AND DEVICES
- Publication number 20210058498
- Publication date Feb 25, 2021
- MICROCHIP TECHNOLOGY INCORPORATED
- Venkat Iyer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTERFACE FOR IMPROVED MEDIA ACCESS, AND RELATED SYSTEMS, METHODS,...
- Publication number 20210058965
- Publication date Feb 25, 2021
- MICROCHIP TECHNOLOGY INCORPORATED
- Dixon Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ETHERNET INTERFACE AND RELATED SYSTEMS METHODS AND DEVICES
- Publication number 20210058177
- Publication date Feb 25, 2021
- MICROCHIP TECHNOLOGY INCORPORATED
- Venkat Iyer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PHYSICAL LAYER TO LINK LAYER INTERFACE AND RELATED SYSTEMS, MTEHODS...
- Publication number 20210058224
- Publication date Feb 25, 2021
- MICROCHIP TECHNOLOGY INCORPORATED
- Venkat Iyer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MEDIA ACCESS FOR TIME-SENSITIVE AND BEST EFFORTS DATA PACKETS, AND...
- Publication number 20200351119
- Publication date Nov 5, 2020
- MICROCHIP TECHNOLOGY INCORPORATED
- Michael Rentschler
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
EMULATING COLLISIONS IN WIRED LOCAL AREA NETWORKS AND RELATED SYSTE...
- Publication number 20200351943
- Publication date Nov 5, 2020
- MICROCHIP TECHNOLOGY INCORPORATED
- Venkat Iyer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CHANGING A MASTER NODE IN A WIRED LOCAL AREA NETWORK AND RELATED SY...
- Publication number 20200343993
- Publication date Oct 29, 2020
- MICROCHIP TECHNOLOGY INCORPORATED
- Michael Rentschler
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Venkat Iyer

Person

Patents Grantslast 30 patents

Physical layer to link layer interface and related systems, methods...

Changing a master node in a wired local area network and related sy...

Ethernet interface and related systems methods and devices

Patents Applicationslast 30 patents

PHYSICAL LAYER TO LINK LAYER INTERFACE AND RELATED SYSTEMS, METHODS...

ETHERNET INTERFACE AND RELATED SYSTEMS, METHODS AND DEVICES

INTERFACE FOR IMPROVED MEDIA ACCESS, AND RELATED SYSTEMS, METHODS,...

ETHERNET INTERFACE AND RELATED SYSTEMS METHODS AND DEVICES

PHYSICAL LAYER TO LINK LAYER INTERFACE AND RELATED SYSTEMS, MTEHODS...

MEDIA ACCESS FOR TIME-SENSITIVE AND BEST EFFORTS DATA PACKETS, AND...

EMULATING COLLISIONS IN WIRED LOCAL AREA NETWORKS AND RELATED SYSTE...

CHANGING A MASTER NODE IN A WIRED LOCAL AREA NETWORK AND RELATED SY...