Venkata Suresh R. GUTHIKONDA

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having sealant bridge
- Patent number 11,676,873
- Issue date Jun 13, 2023
- Intel Corporation
- Dinesh Padmanabhan Ramalekshmi Thanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die back side structures for warpage control
- Patent number 11,322,456
- Issue date May 3, 2022
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Constrained cure component attach process for improved IC package w...
- Patent number 10,290,569
- Issue date May 14, 2019
- Intel Corporation
- Kyle Yazzie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING SEALANT BRIDGE
- Publication number 20200185290
- Publication date Jun 11, 2020
- Intel Corporation
- Dinesh PADMANABHAN RAMALEKSHMI THANU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BACK SIDE STRUCTURES FOR WARPAGE CONTROL
- Publication number 20200066655
- Publication date Feb 27, 2020
- Intel Corporation
- Feras EID
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONSTRAINED CURE COMPONENT ATTACH PROCESS FOR IMPROVED IC PACKAGE W...
- Publication number 20190103345
- Publication date Apr 4, 2019
- Intel Corporation
- Kyle YAZZIE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR