Venkatesh Mohanakrishnaswamy

Person

Chennai, IN

People

Patents Grantslast 30 patents

Information Patent Grant
MEMS packaging scheme using dielectric fence
- Patent number 8,853,850
- Issue date Oct 7, 2014
- STMicroelectronics, Inc.
- Venkatesh Mohanakrishnaswamy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming a die having an IC region adjacent a MEMS region
- Patent number 8,853,802
- Issue date Oct 7, 2014
- STMicroelectronics, Inc.
- Venkatesh Mohanakrishnaswamy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High aspect ratio capacitively coupled MEMS devices
- Patent number 8,680,631
- Issue date Mar 25, 2014
- STMicroelectronics, Inc.
- Venkatesh Mohanakrishnaswamy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High aspect ratio capacitively coupled MEMS devices
- Patent number 8,432,006
- Issue date Apr 30, 2013
- STMicroelectronics, Inc.
- Venkatesh Mohanakrishnaswamy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS packaging scheme using dielectric fence
- Patent number 8,405,202
- Issue date Mar 26, 2013
- STMicroelectronics, Inc.
- Venkatesh Mohanakrishnaswamy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming a die having an IC region adjacent a MEMS region
- Patent number 8,193,595
- Issue date Jun 5, 2012
- STMicroelectronics, Inc.
- Venkatesh Mohanakrishnaswamy
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMS PACKAGING SCHEME USING DIELECTRIC FENCE
- Publication number 20140061824
- Publication date Mar 6, 2014
- STMicroelectronics, Inc.
- Venkatesh Mohanakrishnaswamy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH ASPECT RATIO CAPACITIVELY COUPLED MEMS DEVICES
- Publication number 20130228881
- Publication date Sep 5, 2013
- STMicroelectronics, Inc.
- Venkatesh Mohanakrishnaswamy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FORMING A DIE HAVING AN IC REGION ADJACENT A MEMS REGION
- Publication number 20120235254
- Publication date Sep 20, 2012
- STMICROELECTRONICS ASIA PACIFIC PTE, LTD.
- Venkatesh Mohanakrishnaswamy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH ASPECT RATIO CAPACITIVELY COUPLED MEMS DEVICES
- Publication number 20120056281
- Publication date Mar 8, 2012
- STMicroelectronics, Inc.
- Venkatesh Mohanakrishnaswamy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FORMING A DIE HAVING AN IC REGION ADJACENT A MEMS REGION
- Publication number 20110156175
- Publication date Jun 30, 2011
- STMicroelectronics, Inc.
- Venkatesh Mohanakrishnaswamy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PACKAGING SCHEME USING DIELECTRIC FENCE
- Publication number 20110042801
- Publication date Feb 24, 2011
- STMicroelectronics, Inc.
- Venkatesh Mohanakrishnaswamy
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Venkatesh Mohanakrishnaswamy

Person

Patents Grantslast 30 patents

MEMS packaging scheme using dielectric fence

Method of forming a die having an IC region adjacent a MEMS region

High aspect ratio capacitively coupled MEMS devices

High aspect ratio capacitively coupled MEMS devices

MEMS packaging scheme using dielectric fence

Method of forming a die having an IC region adjacent a MEMS region

Patents Applicationslast 30 patents

MEMS PACKAGING SCHEME USING DIELECTRIC FENCE

HIGH ASPECT RATIO CAPACITIVELY COUPLED MEMS DEVICES

METHOD OF FORMING A DIE HAVING AN IC REGION ADJACENT A MEMS REGION

HIGH ASPECT RATIO CAPACITIVELY COUPLED MEMS DEVICES

METHOD OF FORMING A DIE HAVING AN IC REGION ADJACENT A MEMS REGION

MEMS PACKAGING SCHEME USING DIELECTRIC FENCE