Veronika Huber

Follow

Person

Bad Abbach, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including an antenna
- Patent number 11,195,787
- Issue date Dec 7, 2021
- Infineon Technologies AG
- Ngoc-Hoa Huynh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package with backside die metallization
- Patent number 9,099,454
- Issue date Aug 4, 2015
- Infineon Technologies AG
- Ulrich Wachter
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING AN ANTENNA
- Publication number 20170236776
- Publication date Aug 17, 2017
- INFINEON TECHNOLOGIES AG
- Ngoc-Hoa Huynh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Semiconductor Package with Backside Die Metallization
- Publication number 20150041967
- Publication date Feb 12, 2015
- INFINEON TECHNOLOGIES AG
- Ulrich Wachter
- H01 - BASIC ELECTRIC ELEMENTS