Victor Cher Khng Tan

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a stacked die having a recess in a die BGA pa...
- Patent number 7,799,610
- Issue date Sep 21, 2010
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die with a recess in a die BGA package
- Patent number 7,575,953
- Issue date Aug 18, 2009
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a stacked die having a recess in a die BGA pa...
- Patent number 7,371,608
- Issue date May 13, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die in die BGA package
- Patent number 7,358,117
- Issue date Apr 15, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die in die BGA package
- Patent number 7,344,969
- Issue date Mar 18, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die in die BGA package
- Patent number 7,332,819
- Issue date Feb 19, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die in die BGA package
- Patent number 7,332,820
- Issue date Feb 19, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a stacked die in die BGA package
- Patent number 7,309,623
- Issue date Dec 18, 2007
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die-in-die BGA package with die having a recess
- Patent number 7,282,390
- Issue date Oct 16, 2007
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a stacked die in die BGA package
- Patent number 7,282,392
- Issue date Oct 16, 2007
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BOC BGA package for die with I-shaped bond pad layout
- Patent number 7,112,048
- Issue date Sep 26, 2006
- Micron Technology, Inc.
- Thiam Chye Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Stacked die in die BGA package
- Publication number 20080136045
- Publication date Jun 12, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS

Victor Cher Khng Tan

Person

Patents Grantslast 30 patents

Method of fabricating a stacked die having a recess in a die BGA pa...

Stacked die with a recess in a die BGA package

Method of fabricating a stacked die having a recess in a die BGA pa...

Stacked die in die BGA package

Stacked die in die BGA package

Stacked die in die BGA package

Stacked die in die BGA package

Method of fabricating a stacked die in die BGA package

Stacked die-in-die BGA package with die having a recess

Method of fabricating a stacked die in die BGA package

BOC BGA package for die with I-shaped bond pad layout

Patents Applicationslast 30 patents

Stacked die in die BGA package