TREA

Victor Cher Khng Tan

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  • Singapore, SG
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    STACKED DIE IN DIE BGA PACKAGE
    • Publication number 20130154117
    • Publication date Jun 20, 2013
    • Micron Technology, Inc.
    • Hock Chuan Tan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Stacked Die in Die BGA Package
    • Publication number 20080096316
    • Publication date Apr 24, 2008
    • Micron Technology, Inc.
    • Hock Chuan Tan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Stacked Die in Die BGA Package
    • Publication number 20080032449
    • Publication date Feb 7, 2008
    • Micron Technology, Inc.
    • Hock Chuan Tan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Stacked die in die BGA package
    • Publication number 20060292746
    • Publication date Dec 28, 2006
    • Micron Technology, Inc.
    • Hock Chuan Tan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Stacked die in die BGA package
    • Publication number 20060292743
    • Publication date Dec 28, 2006
    • Micron Technolgoy, Inc.
    • Hock Chuan Tan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Stacked die in die BGA package
    • Publication number 20060292745
    • Publication date Dec 28, 2006
    • Micron Technology, Inc.
    • Hock Chuan Tan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Stacked die in die BGA package
    • Publication number 20060216864
    • Publication date Sep 28, 2006
    • Micron Technology, Inc.
    • Hock Chuan Tan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BOC BGA package for die with I-shaped bond pad layout
    • Publication number 20030211659
    • Publication date Nov 13, 2003
    • Micron Technology, Inc.
    • Thiam Chye Lim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BOC BGA package for die with I-shaped bond pad layout
    • Publication number 20030211660
    • Publication date Nov 13, 2003
    • Micron Technology, Inc.
    • Thiam Chye Lim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Stacked die in die BGA package
    • Publication number 20030207516
    • Publication date Nov 6, 2003
    • Micron Technology, Inc.
    • Hock Chuan Tan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Stacked die in die BGA package
    • Publication number 20030207515
    • Publication date Nov 6, 2003
    • Micron Technology, Inc., Boise, ID
    • Hock Chuan Tan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Stacked die in die BGA package
    • Publication number 20030162325
    • Publication date Aug 28, 2003
    • Micron Technology, Inc.
    • Hock Chuan Tan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BOC BGA package for die with I-shaped bond pad layout
    • Publication number 20030148557
    • Publication date Aug 7, 2003
    • Thiam Chye Lim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Stacked die in die BGA package
    • Publication number 20030148597
    • Publication date Aug 7, 2003
    • Hock Chuan Tan
    • H01 - BASIC ELECTRIC ELEMENTS