Victor Liew

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Fremont, CA, US

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Patents Applicationslast 30 patents

Information Patent Application
Wafer level semiconductor chip packages and methods of making the same
- Publication number 20070267730
- Publication date Nov 22, 2007
- Tessera, Inc.
- Victor Liew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic packages using a ceramic substrate having a window...
- Publication number 20060138626
- Publication date Jun 29, 2006
- Tessera, Inc.
- Victor Liew
- H01 - BASIC ELECTRIC ELEMENTS