Victor Tan Cher Khng

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating semiconductor package with multi-layer die c...
- Patent number 7,550,315
- Issue date Jun 23, 2009
- Micron Technology, Inc.
- Victor Tan Cher 'Khng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor package with multi-layer metal...
- Patent number 7,253,022
- Issue date Aug 7, 2007
- Micron Technology, Inc.
- Victor Tan Cher 'Khng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having substrate with multi-layer metal bumps
- Patent number 7,202,556
- Issue date Apr 10, 2007
- Micron Technology, Inc.
- Victor Tan Cher 'Khng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices
- Patent number 7,145,228
- Issue date Dec 5, 2006
- Micron Technology, Inc.
- Tay Wuu Yean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for packaging microelectronic devices
- Patent number 6,946,325
- Issue date Sep 20, 2005
- Micron Technology, Inc.
- Tay Wuu Yean
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Microelectronic devices and methods for packaging microelectronic d...
- Publication number 20070128737
- Publication date Jun 7, 2007
- Micron Technology, Inc.
- Tay Wuu Yean
- H01 - BASIC ELECTRIC ELEMENTS