Victor Tan Cher 'Khng

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with wire bonded stacked dice and multi-layer...
- Patent number 7,208,828
- Issue date Apr 24, 2007
- Micron Technology, Inc.
- Victor Tan Cher 'Khng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Microelectronic devices and methods for packaging microelectronic d...
- Publication number 20060006534
- Publication date Jan 12, 2006
- Tay Wuu Yean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package having wire bonded die and multi layer metal...
- Publication number 20050173788
- Publication date Aug 11, 2005
- Victor Tan Cher 'Khng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor package with multi-layer metal...
- Publication number 20040232564
- Publication date Nov 25, 2004
- Victor Tan Cher 'Khng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package having substrate with multi-layer metal bumps
- Publication number 20030116866
- Publication date Jun 26, 2003
- Victor Tan Cher 'Khng
- H01 - BASIC ELECTRIC ELEMENTS