Vijay G. ULLAL

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Saratoga, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Wafer-level package device
- Patent number 9,966,350
- Issue date May 8, 2018
- Maxim Integrated Products, Inc.
- Vijay Ullal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including a semiconductor die and a capacitive component
- Patent number 9,478,519
- Issue date Oct 25, 2016
- Fairchild Semiconductor Corporation
- Ahmad R. Ashrafzadeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus related to an improved package including a semiconductor die
- Patent number 9,177,925
- Issue date Nov 3, 2015
- Fairfchild Semiconductor Corporation
- Ahmad R. Ashrafzadeh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE INCLUDING A SEMICONDUCTOR DIE AND A CAPACITIVE COMPONENT
- Publication number 20160126219
- Publication date May 5, 2016
- Fairchild Semiconductor Corporation
- Ahmad R. ASHRAFZADEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS RELATED TO AN IMPROVED PACKAGE INCLUDING A SE...
- Publication number 20140312458
- Publication date Oct 23, 2014
- Fairchild Semiconductor Corporation
- Ahmad ASHRAFZADEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE DEVICE
- Publication number 20120306071
- Publication date Dec 6, 2012
- MAXIM INTEGRATED PRODUCTS, INC.
- Vijay Ullal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reduced Leakage within a Semiconductor Device
- Publication number 20080150092
- Publication date Jun 26, 2008
- Amit Subhash Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to reduce semiconductor device leakage
- Publication number 20080135988
- Publication date Jun 12, 2008
- Maxim Integrated Products, Inc.
- Amit Subhash Kelkar
- H01 - BASIC ELECTRIC ELEMENTS